5SGXMA4H1F35C1N

IC FPGA 600 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA

Quantity 183 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXMA4H1F35C1N – Stratix V GX FPGA, 1152‑FBGA (35×35), 600 I/O

The 5SGXMA4H1F35C1N is a Stratix® V GX field programmable gate array (FPGA) device offering large programmable logic capacity and high I/O density in a 1152‑FBGA (35×35) surface‑mount package. This commercial‑grade FPGA integrates 420,000 logic elements and approximately 37.888 Mbits of embedded RAM to support complex, high‑capacity digital designs.

Key device parameters include a 600‑pin I/O count, core supply range of 870 mV to 930 mV, and an operating temperature range of 0 °C to 85 °C. The device is RoHS‑compliant and supplied in a 1152‑BBGA/FCBGA package for high‑density board layouts.

Key Features

  • Core Logic  420,000 logic elements provide extensive programmable logic resources for large designs.
  • Embedded Memory  Approximately 37.888 Mbits of on‑chip RAM for buffering, state storage, and memory‑intensive logic functions.
  • I/O Capacity  600 device I/O pins enable high‑pin‑count interfacing and dense connectivity options.
  • Package and Mounting  1152‑FBGA (35×35) package case (1152‑BBGA, FCBGA) in a surface‑mount form factor for compact, high‑density PCB designs.
  • Power  Core voltage support from 870 mV to 930 mV for specified operating conditions.
  • Temperature Grade  Commercial operating temperature range from 0 °C to 85 °C.
  • Compliance  RoHS‑compliant manufacturing status.

Unique Advantages

  • High logic capacity: 420,000 logic elements enable implementation of large, complex designs without external logic partitioning.
  • Substantial on‑chip RAM: Approximately 37.888 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks.
  • High I/O density: 600 I/O pins support dense interfaces and multiple parallel buses directly on the device.
  • Compact high‑density package: 1152‑FBGA (35×35) enables a small PCB footprint while preserving pin count for advanced designs.
  • Low core‑voltage operation: Supported core supply range (870 mV–930 mV) aligns with modern low‑voltage system architectures.
  • RoHS compliant and commercial grade: Environmentally compliant production and specified commercial temperature rating (0 °C–85 °C) for general commercial applications.

Why Choose 5SGXMA4H1F35C1N?

The 5SGXMA4H1F35C1N positions itself as a high‑capacity Stratix V GX FPGA option where large logic resources, abundant embedded memory, and substantial I/O count are required in a compact FBGA package. Its combination of 420,000 logic elements, approximately 37.888 Mbits of RAM, and 600 I/O pins makes it suitable for complex digital systems designed for commercial operating conditions.

With a clearly defined core voltage range and RoHS compliance, this device provides deterministic electrical parameters and environmental conformity to support design validation and manufacturing planning.

Request a quote or submit an inquiry for part number 5SGXMA4H1F35C1N to receive pricing and availability information for your project needs.

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