5SGXMA4H1F35C1N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 183 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 158500 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 37888000 |
Overview of 5SGXMA4H1F35C1N – Stratix V GX FPGA, 1152‑FBGA (35×35), 600 I/O
The 5SGXMA4H1F35C1N is a Stratix® V GX field programmable gate array (FPGA) device offering large programmable logic capacity and high I/O density in a 1152‑FBGA (35×35) surface‑mount package. This commercial‑grade FPGA integrates 420,000 logic elements and approximately 37.888 Mbits of embedded RAM to support complex, high‑capacity digital designs.
Key device parameters include a 600‑pin I/O count, core supply range of 870 mV to 930 mV, and an operating temperature range of 0 °C to 85 °C. The device is RoHS‑compliant and supplied in a 1152‑BBGA/FCBGA package for high‑density board layouts.
Key Features
- Core Logic 420,000 logic elements provide extensive programmable logic resources for large designs.
- Embedded Memory Approximately 37.888 Mbits of on‑chip RAM for buffering, state storage, and memory‑intensive logic functions.
- I/O Capacity 600 device I/O pins enable high‑pin‑count interfacing and dense connectivity options.
- Package and Mounting 1152‑FBGA (35×35) package case (1152‑BBGA, FCBGA) in a surface‑mount form factor for compact, high‑density PCB designs.
- Power Core voltage support from 870 mV to 930 mV for specified operating conditions.
- Temperature Grade Commercial operating temperature range from 0 °C to 85 °C.
- Compliance RoHS‑compliant manufacturing status.
Unique Advantages
- High logic capacity: 420,000 logic elements enable implementation of large, complex designs without external logic partitioning.
- Substantial on‑chip RAM: Approximately 37.888 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks.
- High I/O density: 600 I/O pins support dense interfaces and multiple parallel buses directly on the device.
- Compact high‑density package: 1152‑FBGA (35×35) enables a small PCB footprint while preserving pin count for advanced designs.
- Low core‑voltage operation: Supported core supply range (870 mV–930 mV) aligns with modern low‑voltage system architectures.
- RoHS compliant and commercial grade: Environmentally compliant production and specified commercial temperature rating (0 °C–85 °C) for general commercial applications.
Why Choose 5SGXMA4H1F35C1N?
The 5SGXMA4H1F35C1N positions itself as a high‑capacity Stratix V GX FPGA option where large logic resources, abundant embedded memory, and substantial I/O count are required in a compact FBGA package. Its combination of 420,000 logic elements, approximately 37.888 Mbits of RAM, and 600 I/O pins makes it suitable for complex digital systems designed for commercial operating conditions.
With a clearly defined core voltage range and RoHS compliance, this device provides deterministic electrical parameters and environmental conformity to support design validation and manufacturing planning.
Request a quote or submit an inquiry for part number 5SGXMA4H1F35C1N to receive pricing and availability information for your project needs.

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