5SGXMA3K3F40I4WN

The 5SGXMA3K3F40I4WN is a Stratix V GX field programmable gate array (FPGA) IC from Intel, offering a large programmable-logic fabric within a 1517-ball FCBGA (1517-FBGA, 40×40) package. Built for designs that require high logic capacity, substantial embedded memory, and extensive I/O, this device targets complex digital implementations that must operate across an industrial temperature range.

Key architectural characteristics include approximately 340,000 logic elements, roughly 19.5 Mbits of embedded memory, and up to 600 I/O pins, with core supply operation in the 820 mV–880 mV range. The device is RoHS compliant and specified for surface-mount PCB assembly.

Key Features

• Core Logic Capacity  Approximately 340,000 logic elements, providing large-scale programmable logic resources for complex designs.
• Logic Array Structure  128,300 LABs/CLBs reported for structured logic partitioning and resource planning.
• Embedded Memory  Approximately 19.5 Mbits of on-chip RAM to support buffering, state storage, and mid-density memory requirements.
• I/O Density  Up to 600 I/O pins to support high-pin-count interfaces and multiple parallel buses.
• Power and Core Voltage  Core voltage supply range specified between 820 mV and 880 mV for compatible low-voltage core systems.
• Package and Mounting  1517-BBGA / FCBGA package (supplier package: 1517-FBGA, 40×40) designed for surface-mount assembly on high-density PCBs.
• Temperature Range  Industrial-grade operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance  RoHS compliant, meeting standard lead-free environmental requirements.

Typical Applications

• High-density logic implementations  Large combinational and sequential designs that require extensive programmable logic and embedded RAM capacity.
• I/O-intensive systems  Designs that need high pin counts for parallel interfaces, large connector arrays, or multi-channel data paths.
• Industrial-temperature deployments  Systems that must maintain functionality across −40 °C to 100 °C operating conditions.
• Low-voltage core platforms  Designs built around low-voltage FPGA core domains, with specified supply support between 820 mV and 880 mV.

Unique Advantages

• Substantial programmable capacity: Approximately 340k logic elements enable consolidation of complex logic into a single device, reducing board-level component count.
• Generous embedded memory: ~19.5 Mbits of on-chip RAM supports buffering, packet staging, and stateful processing without external memory for many use cases.
• High I/O count: Up to 600 I/O pins facilitate multi-channel interfaces and high-bandwidth parallel connectivity.
• Industrial temperature rating: Specified for −40 °C to 100 °C operation, suitable for temperature-challenging environments.
• Compact FCBGA packaging: 1517-ball FCBGA (40×40) consolidates high density in a surface-mount package suitable for space-constrained PCBs.
• Environmental compliance: RoHS compliance supports lead-free manufacturing requirements.

Why Choose 5SGXMA3K3F40I4WN?

This Stratix V GX device combines large logic capacity, substantial embedded RAM, and a high I/O count in an industrial-temperature-rated FCBGA package, making it well suited for complex digital systems that must operate reliably under wide temperature ranges. Its specified core voltage range and surface-mount FCBGA form factor simplify integration into modern low-voltage, high-density PCB designs.

Manufactured under the Stratix V family and supported by the Stratix V device documentation, the 5SGXMA3K3F40I4WN is positioned for designers who need scalable programmable logic resources, significant on-chip memory, and robust I/O in industrial applications.

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