5SGXMA4H1F35C2G

The 5SGXMA4H1F35C2G is a Stratix V GX field programmable gate array (FPGA) IC in a 1152-BBGA FCBGA package offering high logic density and a large I/O count. As a commercial-grade Stratix V GX device, it delivers significant on-chip memory and logic resources alongside a wide I/O complement for complex, high‑density digital designs.

Designed for applications that require substantial embedded memory, extensive I/O connectivity, and fine-grained core power control, this device provides the building blocks for scalable, performance‑oriented FPGA designs within the specified commercial operating range.

Key Features

• Logic Capacity  Provides 420,000 logic elements, enabling implementation of large-scale digital logic networks and complex custom functions.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM to support buffering, state storage, and memory‑intensive logic functions.
• I/O Density  Up to 600 user I/Os to consolidate multiple interfaces and reduce board-level interconnect complexity.
• Transceiver Family  Part of the Stratix V GX family; Stratix V GX/GS series datasheet lists GX transceiver speed grade options (e.g., GX channel—14.1 Gbps and 12.5 Gbps) for designs requiring high-speed serial links.
• Power and Core Voltage  Core supply range specified from 870 mV to 930 mV, allowing designers to plan power delivery and optimize core operation within the defined window.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for applications targeting commercial environments.
• Packaging & Mounting  1152‑BBGA (FCBGA) package with supplier device package listed as 1152‑FBGA (35×35); surface-mount mounting type for compact board layouts.
• Standards & Compliance  RoHS‑compliant, supporting regulatory-driven manufacturing and material selection.

Typical Applications

• High-density digital processing: Use the large logic element count and embedded RAM to implement complex signal processing, packet processing, or custom compute blocks.
• Multi-interface bridging and aggregation: High I/O count enables consolidation of parallel and serial interfaces, reducing external glue logic and PCB complexity.
• Memory‑intensive FPGA functions: Approximately 37.9 Mbits of on-chip RAM supports buffering, FIFOs, and state machines for real-time data handling.

Unique Advantages

• High logic density: 420,000 logic elements provide the capacity to implement large, integrated digital systems on a single device.
• Large I/O complement: 600 I/Os simplify system integration by accommodating multiple interfaces without extensive external multiplexing.
• Substantial on-chip memory: Approximately 37.9 Mbits of embedded RAM reduces reliance on external memory for many buffering and state storage needs.
• Commercial-grade specification: Designed for 0 °C to 85 °C operation, matching typical commercial application environments.
• Package options for dense boards: 1152‑BBGA FCBGA (35×35) enables compact, high‑density PCB layouts suitable for space-constrained designs.
• RoHS compliant: Supports environmentally driven manufacturing requirements.

Why Choose 5SGXMA4H1F35C2G?

The 5SGXMA4H1F35C2G positions itself as a high‑capacity commercial Stratix V GX FPGA suited for designs that need abundant logic resources, significant embedded memory, and extensive I/O. Its defined core voltage range and commercial temperature rating allow engineering teams to plan power and thermal management within standard commercial system envelopes.

Choose this device when you require a single‑chip solution to consolidate complex digital functions, deliver memory‑heavy workloads, and support large interface counts while maintaining RoHS compliance and a compact FCBGA footprint.

Request a quote or submit an order inquiry to receive pricing and availability information for the 5SGXMA4H1F35C2G. Our team can provide technical and procurement support to help integrate this Stratix V GX FPGA into your design.