5SGXMA4H1F35C2WN

The 5SGXMA4H1F35C2WN is a Stratix V GX field programmable gate array (FPGA) IC designed for high-density, high-I/O programmable-logic applications. It combines a large logic fabric and significant on-chip memory with a high pin count to support complex digital designs that require substantial integration on a single device.

Targeted at commercial-grade designs, this device provides designers with a balance of logic capacity, embedded RAM, and I/O resources while offering surface-mount packaging and RoHS compliance for modern electronic assemblies.

Key Features

• Logic Capacity  Provides 420,000 logic elements to implement large-scale digital functions and complex state machines on a single FPGA.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive logic blocks.
• I/O Resources  600 user I/O pins to connect to multiple external interfaces and high-pin-count systems.
• Power  Core voltage supply range of 870 mV to 930 mV for the device core power domain.
• Package & Mounting  Delivered in a 1152-BBGA (FCBGA) package, supplier device package 1152-FBGA (35 × 35), optimized for surface-mount assembly.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant for lead-free manufacturing requirements.

Typical Applications

• High-density digital processing  Leverage the large logic capacity and embedded RAM to implement complex packet processing, signal processing, or algorithm acceleration blocks.
• I/O-intensive interface bridging  Use the 600 I/Os to connect multiple buses, peripherals, or mezzanine interfaces in multi-board systems.
• Prototyping and system integration  Suitable for consolidating multiple functions into a single FPGA during prototype and pre-production phases where commercial-grade operation is acceptable.

Unique Advantages

• High integration density: The 420,000 logic elements reduce the need for multiple devices, simplifying board-level design and lowering inter-device connectivity.
• Substantial on-chip RAM: Approximately 37.9 Mbits of embedded memory supports deep buffering and complex state retention without external memory.
• Extensive I/O capacity: 600 I/Os enable broad connectivity options for multi-interface systems and dense peripheral ecosystems.
• Compact FCBGA package: The 1152-BBGA (35 × 35) package offers a high-pin-count solution in a footprint suitable for surface-mount assembly.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to meet standard commercial application environments.
• RoHS compliant: Supports lead-free board assembly and regulatory-compliant product builds.

Why Choose 5SGXMA4H1F35C2WN?

This Stratix V GX FPGA delivers a combination of high logic capacity, significant embedded memory, and a large I/O complement in a surface-mount FCBGA package, making it well suited for commercial applications that require consolidated digital functionality on a single device. Its power and thermal ratings align with standard commercial electronic systems, and RoHS compliance supports modern manufacturing processes.

Designers seeking to implement dense programmable logic, substantial buffering, and broad external connectivity will find this device appropriate for complex prototypes and production designs that operate within commercial temperature ranges.

Request a quote or submit a pricing inquiry to receive availability and commercial pricing information for the 5SGXMA4H1F35C2WN.