5SGXMA4H2F35C1G

IC FPGA 600 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA

Quantity 879 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXMA4H2F35C1G – Stratix® V GX FPGA, 420,000 logic element cells, 600 I/O, 1152-FBGA

The 5SGXMA4H2F35C1G is a Stratix® V GX Field Programmable Gate Array (FPGA) supplied in a 1152-FBGA (35×35) package for surface-mount assembly. It provides high on-chip logic and memory capacity alongside a large I/O count, making it suited to complex digital designs that require dense logic, abundant embedded RAM, and extensive external connectivity.

Designed and specified as a commercial-grade device, this Stratix V GX part operates within a core supply voltage window of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C. Series-level documentation for Stratix V GX devices also describes high-speed transceiver capabilities at the family level.

Key Features

  • Core Logic Density  Provides 420,000 logic element cells to implement large-scale digital logic and custom processing blocks.
  • Embedded Memory  Approximately 37.9 Mbits of on-chip RAM for buffering, lookup tables, and state storage within the FPGA fabric.
  • Extensive I/O  600 I/O pins to support a wide range of parallel interfaces and high-pin-count board connections.
  • Power and Voltage  Core supply specified between 870 mV and 930 mV to match low-voltage FPGA core requirements described in device specifications.
  • Package and Mounting  1152-BBGA / FCBGA package (supplier package: 1152-FBGA, 35×35); surface-mount mounting type for compact, high-density PCB layouts.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, aligning with commercial-grade system deployments.
  • RoHS Compliant  Manufactured in compliance with RoHS requirements.
  • Series-Level Transceiver Capability  Stratix V GX family documentation indicates transceiver channel speeds supported at the series level (see device datasheet for family-level speed grades).

Typical Applications

  • Complex digital systems  Use where large-scale logic integration is required, leveraging 420,000 logic element cells to implement substantial custom logic and processing pipelines.
  • I/O‑intensive designs  Ideal for designs needing many external interfaces or parallel buses, utilizing the 600 available I/O pins.
  • On-chip buffering and data handling  Embedded memory (≈37.9 Mbits) supports packet buffering, FIFOs, and other data storage tasks within the FPGA fabric.
  • Commercial-grade embedded products  Suitable for commercial temperature applications within the 0 °C to 85 °C range and surface-mount PCB assembly.

Unique Advantages

  • High logic capacity: 420,000 logic element cells provide the headroom to implement complex state machines, datapaths, and custom accelerators without external logic.
  • Substantial on-chip RAM: Approximately 37.9 Mbits of embedded memory reduces dependence on external memory for many buffering and LUT-based functions.
  • Large I/O footprint: 600 I/O pins simplify routing of multiple parallel interfaces, sensors, and peripheral connections without multiplexing compromises.
  • Compact BGA packaging: 1152-FBGA (35×35) offers a high-pin-count footprint in a single compact package suitable for dense PCB layouts.
  • Commercial operating range: Specified 0 °C to 85 °C and RoHS compliance enables reliable use in commercial products and standard manufacturing flows.
  • Family-level high-speed options: Stratix V GX family documentation details transceiver speed grades at the series level for designs that may require high-speed serial links (refer to the device datasheet for family capabilities).

Why Choose 5SGXMA4H2F35C1G?

The 5SGXMA4H2F35C1G combines high logic density, significant on-chip memory, and a large I/O count inside a compact 1152-FBGA package to support demanding commercial-grade FPGA applications. Its electrical and thermal specifications align with standard commercial embedded systems, and the Stratix V GX family documentation provides further guidance on series-level high-speed transceiver capabilities.

This part is well suited to designers and teams building complex digital systems that require integrated memory, broad connectivity, and a proven device family footprint—offering scalability and platform consistency for multi-board or multi-variant designs.

Request a quote or submit an inquiry to receive pricing, lead time, and availability information for the 5SGXMA4H2F35C1G.

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