5SGXMA4H1F35I2G

IC FPGA 600 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA

Quantity 931 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXMA4H1F35I2G – Stratix V GX FPGA, 420,000 logic elements, 600 I/Os, 1152-BBGA

The 5SGXMA4H1F35I2G is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) offered in an industrial temperature grade. It provides a high-density programmable logic fabric with 420,000 logic elements and approximately 38 Mbits of embedded memory to support complex, resource-intensive designs.

Packaged in a 1152-position FCBGA (1152-FBGA, 35×35) and supporting a core voltage supply of 870 mV to 930 mV, this device targets applications that require large I/O counts (600 device I/Os) and operation across an extended temperature range of –40°C to 100°C. Series-level documentation also details Stratix V GX transceiver speed grades for high-speed serial interfaces.

Key Features

  • High-density programmable logic  420,000 logic elements (logic cells) for implementing complex custom logic and algorithms.
  • Embedded memory  Approximately 38 Mbits of on-chip RAM to support large data buffering, caches, and memory-intensive functions.
  • I/O capacity  600 device I/Os to accommodate I/O-dense systems and large FPGA-to-board interfacing requirements.
  • Industrial temperature grade  Rated for operation from –40°C to 100°C for deployment in industrial environments.
  • Package and mounting  1152-BBGA FCBGA package (supplier device package: 1152-FBGA, 35×35) with surface-mount mounting type for high-density board integration.
  • Core voltage  Specified core voltage supply range of 870 mV to 930 mV for power rail planning.
  • RoHS compliant  Environmentally compliant with RoHS status indicated as compliant.
  • Series transceiver capability (documented)  Stratix V GX series datasheet documents transceiver speed grades (GX channel speeds up to 14.1 Gbps at series level).

Typical Applications

  • High-density logic implementations  Use the device's 420,000 logic elements to realize complex state machines, protocol engines, and custom datapaths.
  • I/O-intensive systems  Leverage 600 device I/Os for applications requiring extensive sensor, control, or board-level interfacing.
  • Memory-heavy designs  Embedded ~38 Mbits of RAM supports buffering, packet processing, and intermediate data storage on-chip.
  • Industrial deployments  Rated operation from –40°C to 100°C makes the device suitable for industrial environments requiring extended temperature tolerance.
  • High-speed serial interfaces  Series-level transceiver documentation supports designs that include high-speed serial channels (see datasheet for applicable speed grades).

Unique Advantages

  • Highly integrated resource set: 420,000 logic elements combined with approximately 38 Mbits of embedded memory reduces the need for external resources and simplifies board-level design.
  • I/O density: 600 device I/Os enable complex system integration and support for wide parallel interfaces or many peripheral connections.
  • Industrial temperature range: Operation from –40°C to 100°C supports robust deployment in demanding environments.
  • Compact high-pin-count package: 1152-FBGA (35×35) package delivers high I/O and logic density in a compact form factor for space-constrained PCBs.
  • Power rail clarity: Defined core voltage range (870 mV–930 mV) assists power system design and thermal planning.
  • Standards-conscious supply chain: RoHS compliance supports regulatory and environmental requirements.

Why Choose 5SGXMA4H1F35I2G?

The 5SGXMA4H1F35I2G positions itself as a high-density, industrial-grade Stratix V GX FPGA for designs that demand extensive programmable logic, on-chip memory, and plentiful I/O. Its documented series transceiver capabilities and the device’s package and thermal specifications make it suitable for engineering teams building I/O-dense, memory-intensive, and temperature-challenging applications.

For development and deployment, the device offers a combination of scalability and robustness tied to Intel’s Stratix V family documentation and specifications, helping teams plan power, thermal, and layout requirements with precise, verifiable device parameters.

Request a quote or submit a quotation for 5SGXMA4H1F35I2G to evaluate this Stratix V GX FPGA for your next design.

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