5SGXMA4H1F35C2LG

The 5SGXMA4H1F35C2LG is an Intel Stratix® V GX field-programmable gate array (FPGA) in a 1152‑FBGA (35×35) package. It delivers very high logic density and substantial on‑chip embedded memory, combined with a large I/O count suitable for complex, I/O‑heavy designs.

Engineered for commercial temperature operation, this device targets applications that require high integration of programmable logic, abundant embedded RAM, and extensive I/O connectivity while operating from a low core supply voltage.

Key Features

• Core Logic  Approximately 420,000 logic elements to implement large, parallel datapaths, custom accelerators, and complex state machines.
• Embedded Memory  Approximately 38 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage.
• I/O Density  600 I/Os to support wide parallel interfaces, multiple peripherals, or multi‑lane I/O routing on dense PCBs.
• Power and Voltage  Core supply requirement of 820 mV to 880 mV, enabling low‑voltage FPGA core operation as part of a modern power budget.
• Package & Mounting  1152‑FBGA (35×35) FCBGA package, surface‑mount mounting suitable for automated PCB assembly and dense board layouts.
• Temperature & Grade  Commercial grade operation from 0 °C to 85 °C, meeting typical commercial electronics deployment requirements.
• Compliance  RoHS compliant to support lead‑free product designs and regulatory requirements.
• Device Family Documentation  Part of the Stratix V GX family; device datasheet includes electrical, switching, and I/O timing characteristics for design and system integration.

Typical Applications

• High‑performance networking equipment  Large logic and memory capacity plus extensive I/O enable packet processing, buffering, and custom protocol implementations.
• Data processing and acceleration  High logic density and sizable embedded RAM support compute acceleration tasks and custom hardware pipelines.
• Multi‑lane I/O systems  600 I/Os accommodate wide bus interfaces, parallel sensors, or multi‑channel connectivity on complex boards.
• Video and imaging pipelines  Abundant logic and on‑chip RAM facilitate frame buffering, real‑time processing, and parallel video paths.

Unique Advantages

• High integration density: Enables consolidation of multiple functions into a single device, reducing BOM and board area.
• Substantial on‑chip memory: Approximately 38 Mbits of embedded RAM reduces dependence on external memory for buffering and accelerates data‑path performance.
• Extensive I/O capability: 600 I/Os provide flexibility for interfacing with many external devices, sensors, and high‑pincount connectors.
• Low core voltage operation: 820–880 mV core supply supports modern low‑power system designs and power‑optimized architectures.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to fit standard commercial product environments.
• RoHS compliant: Facilitates lead‑free manufacturing and regulatory compliance for commercial products.

Why Choose 5SGXMA4H1F35C2LG?

The 5SGXMA4H1F35C2LG delivers a combination of high logic capacity, significant embedded memory, and a very large I/O count in a compact 1152‑FBGA package. This balance of resources is well suited to designers building complex, I/O‑centric systems that require on‑device buffering and dense programmable logic.

For commercial designs seeking scalability and integration, this Stratix V GX device provides the measurable resources—logic elements, on‑chip RAM, and I/O—to simplify board design, reduce external component count, and accelerate time‑to‑market while remaining within common commercial operating conditions.

Request a quote or submit a sales inquiry to evaluate 5SGXMA4H1F35C2LG for your next design and receive pricing and availability details.