5SGXMA4H2F35C1WN

The 5SGXMA4H2F35C1WN is an Intel Stratix V GX field programmable gate array (FPGA) offered in a 1152-ball FCBGA package. It provides a high-density programmable fabric with significant on-chip memory and extensive I/O resources for advanced digital designs.

Designed as a commercial-grade device, this Stratix V GX part targets applications that require large logic capacity, substantial embedded RAM, programmable I/O timing and high channel counts while operating within a core voltage range of 870 mV to 930 mV and a commercial temperature window of 0 °C to 85 °C.

Key Features

• High Logic Density  Approximately 420,000 logic elements to implement complex, large-scale digital designs and advanced custom logic functions.
• Embedded Memory  Approximately 38 Mbits of on-chip RAM to support buffering, large LUT-based storage and state machines without external memory.
• Extensive I/O Count  600 I/O pins enable rich interfacing options for multi-channel systems, daughtercards, and dense board-level connectivity.
• Transceiver and I/O Support (Series-Level)  Part of the Stratix V GX family with documented transceiver specifications and programmable I/O element timing for designs that require configurable signal timing and serial interfaces.
• Power and Supply  Core supply range specified at 870 mV to 930 mV to match regulated FPGA core power domains.
• Package and Mounting  1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting for standard PCB assembly processes.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C.
• Standards Compliance  RoHS compliant material status for environmental requirements.

Typical Applications

• High-speed serial and backplane interfaces  Leverages the Stratix V GX family transceiver and I/O timing capabilities for designs requiring configurable serial channels and timing control.
• Memory‑intensive logic  Approximately 38 Mbits of embedded RAM supports buffering, packet processing, and on-chip storage for throughput-critical systems.
• Multi‑channel I/O systems  600 I/Os accommodate dense sensor arrays, multi-port connectivity, and front-end aggregation on I/O-heavy boards.

Unique Advantages

• Large programmable fabric: The device’s ~420k logic elements let you implement extensive custom logic and complex state machines on-chip, reducing external component needs.
• Significant on-chip memory: Approximately 38 Mbits of embedded RAM enables substantial local storage for low-latency buffering and data manipulation.
• High I/O capacity: 600 I/Os simplify system partitioning and reduce the need for additional I/O expanders in dense designs.
• Flexible I/O and timing: Family-level support for programmable I/O element delay and output buffer delay allows precise timing adjustments during board bring-up and signal tuning.
• Commercial-grade reliability: Specified operating range of 0 °C to 85 °C and RoHS compliance make it suitable for mainstream commercial electronic products.
• Compact, high-ball-count package: 1152-ball FCBGA package supports high pin density while maintaining a surface-mount form factor for modern PCB layouts.

Why Choose 5SGXMA4H2F35C1WN?

The 5SGXMA4H2F35C1WN delivers substantial programmable resources, ample embedded memory and a high I/O count in a single commercial-grade Stratix V GX FCBGA package. Its specified core voltage range and family-level transceiver/I/O timing features make it a practical choice for engineers building complex, timing-sensitive digital systems that need on-chip capacity and flexible interfacing.

This part is well-suited to teams seeking a scalable FPGA platform with a strong balance of logic density, embedded RAM and I/O resources, backed by the Stratix V device family documentation and design ecosystem.

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