5SGXMA3K3F40I3WN

The 5SGXMA3K3F40I3WN is an Intel Stratix® V GX field‑programmable gate array supplied in a 1517‑FBGA (40×40) package. It provides a high logic density of 340,000 logic elements and approximately 19.456 Mbits of embedded memory, with up to 600 I/Os for complex interfacing and system integration.

Designed for industrial‑grade applications, the device operates from 820 mV to 880 mV and across an extended temperature range of −40 °C to 100 °C, making it suitable for demanding environments that require large programmable logic capacity and extensive I/O connectivity.

Key Features

• Core Density  340,000 logic elements provide substantial programmable logic resources for complex digital designs and high‑function integration.
• Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM to support large buffers, packet processing, and algorithmic storage close to logic.
• I/O Capability  Up to 600 I/Os enable broad external device interfacing, parallel buses, and multi‑channel connectivity.
• Power Supply  Core supply operating range of 820 mV to 880 mV to match system power architecture requirements.
• Package & Mounting  1517‑BBGA (FCBGA) package in a 1517‑FBGA (40×40) footprint delivered as a surface‑mount device for compact board designs.
• Temperature & Grade  Industrial grade device rated for −40 °C to 100 °C, suitable for extended temperature applications.
• Standards Compliance  RoHS‑compliant to meet environmental and manufacturing requirements.

Typical Applications

• Telecommunications & Networking  High logic density and large I/O count support packet processing, switch/router functions, and multi‑lane interface aggregation.
• Data Center & Acceleration  Embedded memory and extensive programmable logic enable complex dataflow pipelines and on‑device buffering for acceleration tasks.
• High‑Speed Interface Bridging  Large I/O capacity and high logic resources allow implementation of protocol translation, aggregation, and custom I/O subsystems.

Unique Advantages

• High Integration Density: 340,000 logic elements and ~19.456 Mbits of on‑chip RAM reduce the need for external logic and memory, simplifying BOM and board layout.
• Extensive I/O Count: Up to 600 I/Os provide flexibility for multi‑channel designs and dense peripheral connectivity without sacrificing board real estate.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployments in harsh or industrial environments.
• Compact Surface‑Mount Package: 1517‑FBGA (40×40) package enables high‑density PCB implementations while maintaining robust thermal and mechanical characteristics.
• Controlled Core Voltage Range: 820–880 mV core supply range aligns with precision power architectures and helps manage power delivery on dense FPGA designs.
• RoHS Compliant: Conforms to environmental manufacturing requirements for modern production standards.

Why Choose 5SGXMA3K3F40I3WN?

The 5SGXMA3K3F40I3WN delivers a balanced combination of very high logic capacity, significant embedded memory, and a large number of I/Os in a compact surface‑mount FCBGA package. Its industrial temperature rating and controlled core supply range make it suitable for robust, high‑density designs that require reliable operation across extended environments.

This device is well suited to engineering teams building complex FPGA‑centric systems—such as networking infrastructure, data processing accelerators, and multi‑interface controllers—where on‑chip resources and dense I/O reduce external components and accelerate time to market.

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