5SGXMA3K3F40I3LG

The 5SGXMA3K3F40I3LG is an Intel Stratix® V GX field programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package. This industrial-grade device integrates a high logic element count, substantial on-chip RAM, and broad I/O capability for high-density, system-level digital designs.

Designed for applications that require large programmable logic capacity, significant embedded memory, and wide operating temperature headroom, the device delivers a balanced combination of integration and reliability suitable for industrial environments.

Key Features

• Logic Capacity  Approximately 340,000 logic elements to implement complex logic, state machines, and custom accelerators.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage without external memory.
• I/O Resources  600 user I/O pins to connect high-pin-count interfaces and multi-channel systems.
• Package and Mounting  Surface-mount 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40), enabling high-density board integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in temperature-challenging industrial applications.
• Core Voltage  Core supply range from 820 mV to 880 mV, consistent with Stratix V GX device power domains.
• RoHS Compliance  Device is RoHS compliant, supporting regulatory requirements for lead-free assemblies.
• Stratix V GX Series Characteristics  Part of the Stratix V GX family; refer to the Stratix V device documentation for device-level electrical and transceiver characteristics.

Typical Applications

• High-density FPGA implementations  Implement complex, large-scale programmable logic and custom processing pipelines using the device's ~340k logic elements and embedded memory.
• Multi-interface systems  Integrate numerous parallel and serial interfaces with up to 600 user I/Os for board-level consolidation.
• Industrial control and automation  Deploy in systems that require industrial temperature operation (−40 °C to 100 °C) and robust on-chip resources.
• System prototyping and integration  Use the FCBGA package for compact, high-density board designs where surface-mount BGA footprints are preferred.

Unique Advantages

• High logic density: Approximately 340,000 logic elements enable implementation of large, feature-rich designs without immediate external logic expansion.
• Substantial embedded memory: Approximately 19.456 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O count: 600 I/Os simplify integration of multi-channel peripherals and high-pin-count interfaces, reducing external glue logic.
• Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in temperature-demanding environments.
• Compact BGA packaging: 1517-BBGA (FCBGA) package supports dense PCB layouts and reliable surface-mount assembly.
• Standards-aligned compliance: RoHS compliance supports environmentally regulated manufacturing and product distribution.

Why Choose 5SGXMA3K3F40I3LG?

The 5SGXMA3K3F40I3LG combines high logic capacity, notable embedded memory, and a large I/O footprint in an industrial-grade Stratix V GX device package. Its electrical characteristics and operating-range specifications make it suitable for demanding digital designs that need on-chip resources and temperature resilience.

Engineers and system designers seeking a scalable FPGA platform with documented Stratix V GX device characteristics will find this part appropriate for applications that prioritize integration density, significant on-chip RAM, and robust I/O connectivity.

Request a quote or submit an inquiry for pricing and availability to proceed with design evaluation and procurement.