5SGXMA3K3F40I3G

The 5SGXMA3K3F40I3G is a Stratix V GX field-programmable gate array (FPGA) from Intel, supplied in a 1517-BBGA FCBGA package. It delivers high logic capacity, substantial embedded memory, and a large number of I/O pins for industrial applications that require dense, reconfigurable digital logic and extensive peripheral connectivity.

Key Features

• Core Logic — 340,000 logic elements provide extensive programmable logic resources for complex designs.
• Logic Blocks — 128,300 logic blocks for structured logic partitioning and implementation.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
• I/O Capacity — 600 user I/Os to interface with wide parallel buses, peripherals, and high-density connectors.
• Power Supply — Core voltage supply range from 820 mV to 880 mV for defined power and timing conditions.
• Package & Mounting — 1517-BBGA (FCBGA) package, supplier device package listed as 1517-FBGA (40×40); surface-mount mounting type for standard PCB assembly.
• Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in industrial environments.
• Compliance — RoHS compliant, meeting common environmental requirements for electronic assemblies.

Typical Applications

• Industrial Controls — Industrial temperature rating and broad I/O support make this device suitable for programmable logic in factory automation and motion control systems.
• High-density Data Processing — Large logic element count and substantial on-chip RAM support custom data-path engines and streaming data manipulation.
• Communications and Networking — High I/O count enables interface aggregation and protocol bridging in networking equipment and infrastructure modules.
• Custom Hardware Acceleration — Dense programmable logic and memory enable implementation of application-specific accelerators for compute or signal processing tasks.

Unique Advantages

• Extensive Logic Resources: 340,000 logic elements allow implementation of complex state machines, datapaths, and custom processors without external logic.
• Significant On-chip Memory: Approximately 19.456 Mbits of embedded memory reduces reliance on external RAM for many buffering and storage use cases.
• High I/O Count: 600 I/Os provide flexibility for multi-channel interfaces, wide buses, and dense connector applications.
• Industrial-ready Operation: Rated for −40 °C to 100 °C operation and specified as industrial grade for deployment in harsh environments.
• Compact FCBGA Packaging: The 1517-BBGA package delivers high pin density in a compact form factor suitable for modern PCB layouts.
• Standards-aligned Supply: RoHS compliance supports environmentally conscious designs and regulatory alignment.

Why Choose 5SGXMA3K3F40I3G?

The 5SGXMA3K3F40I3G positions itself as a high-capacity Stratix V GX FPGA option for industrial applications that demand a combination of large programmable logic resources, significant on-chip memory, and extensive I/O. Its industrial temperature rating and FCBGA package make it suitable for robust, high-density designs where board space and environmental tolerance are critical.

Backed by Intel's Stratix V documentation and product support, this device is appropriate for engineering teams building scalable, reconfigurable systems that benefit from high integration and accessible on-chip resources.

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