5SGXMA3K3F40C4WN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 285 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 128300 | Number of Logic Elements/Cells | 340000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGXMA3K3F40C4WN – Stratix® V GX Field Programmable Gate Array (FPGA) IC, 340,000 logic elements, 600 I/Os
The 5SGXMA3K3F40C4WN is a Stratix V GX Field Programmable Gate Array (FPGA) IC offered in a commercial temperature grade. It integrates a large programmable fabric with 340,000 logic elements and approximately 19.456 Mbits of embedded RAM to address complex digital designs that require high logic density and on-chip memory.
Packaged in a 1517-BBGA (FCBGA) / 1517-FBGA (40×40) footprint with surface-mount mounting, the device provides up to 600 user I/Os and operates from a core voltage supply range of 820–880 mV within an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.
Key Features
- Programmable Logic Capacity 340,000 logic elements and 128,300 LABs (logic array blocks) provide extensive on-chip gate count for complex logic and control functions.
- On-chip Memory Approximately 19.456 Mbits of embedded RAM for data buffering, FIFOs, and logic-local storage without relying on external memory.
- High I/O Count Up to 600 user I/Os support dense connectivity for multi-channel interfaces, parallel buses, and system integration.
- Power and Supply Core voltage supply range of 820–880 mV enables defined power domain planning for core logic.
- Package and Mounting 1517-BBGA (FCBGA) package — supplier device package listed as 1517-FBGA (40×40) — optimized for surface-mount assembly.
- Commercial Temperature Grade Specified operating temperature range of 0 °C to 85 °C for commercial deployments.
- Regulatory Compliance RoHS compliant.
Unique Advantages
- Large integrated logic and memory: The combination of 340,000 logic elements and roughly 19.456 Mbits of embedded RAM enables complex finite-state machines, packet processing, and sizeable buffer implementations without external memory.
- High pin-count I/O: With 600 available I/Os, the device supports dense parallel interfaces and multi-channel connectivity, simplifying board-level routing for multi-lane designs.
- Defined commercial-operating envelope: Commercial grade and a specified 0 °C to 85 °C operating range simplify qualification for typical commercial applications.
- Compact BGA packaging for surface-mount assembly: The 1517-BBGA / 1517-FBGA (40×40) package allows high-density integration while maintaining a standardized footprint.
- Clear supply requirements: Specified core supply range (820–880 mV) helps streamline power-supply design and validation.
- RoHS compliance: Facilitates adoption in regions and programs requiring lead-free, environmentally compliant components.
Why Choose 5SGXMA3K3F40C4WN?
The 5SGXMA3K3F40C4WN delivers a balance of large logic capacity, substantial on-chip memory, and high I/O density in a commercial-grade Stratix V GX FPGA package. Its clearly specified electrical and environmental parameters make it suitable for demanding digital designs that need a high degree of integration on a single device.
This part is well suited to design teams and procurement professionals seeking a high-density FPGA platform with defined supply and temperature ranges, compact BGA packaging for surface-mount assembly, and RoHS compliance for broad deployment.
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