5SGXMA3K3F40I3N

The 5SGXMA3K3F40I3N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in an industrial temperature grade and packaged in a 1517-BBGA FCBGA (supplier package: 1517-FBGA, 40×40). This device provides high logic density—340,000 logic elements—and approximately 19.456 Mbits of embedded memory, together with 600 general-purpose I/Os for large, I/O‑rich designs.

Designed for applications that require substantial on-chip logic and memory capacity under industrial operating conditions, the device operates from a core supply range of 820 mV to 880 mV and supports an operating temperature range of −40 °C to 100 °C. The device is RoHS compliant.

Key Features

• Core Logic 340,000 logic elements and 128,300 LABs (logic array blocks) provide extensive programmable logic resources for complex designs.
• Embedded Memory Approximately 19.456 Mbits of on-chip RAM for data buffering, state storage, and local memory-intensive functions.
• I/O Capacity 600 I/O pins support dense external connectivity and flexible interfacing to peripherals and subsystems.
• Package Delivered in a 1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40×40) suitable for surface-mount board assembly.
• Power Core voltage supply range: 820 mV to 880 mV, enabling designers to plan accurate power delivery and sequencing.
• Temperature and Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Standards Compliance RoHS compliant to support environmental and regulatory requirements.

Typical Applications

• Industrial Control Industrial-grade temperature range and high I/O count enable robust interfacing and large control logic implementations for factory automation and process control equipment.
• Data Processing and Acceleration High logic element count and substantial embedded memory support custom data-paths, parallel processing, and hardware acceleration functions.
• High‑I/O Systems With 600 I/Os, the device is suited for systems requiring extensive peripheral connectivity, multi‑lane interfaces, or dense sensor and actuator links.
• High‑Speed Serial Designs As a Stratix V GX family device, refer to the device datasheet for available transceiver and speed‑grade options when designing serial connectivity solutions.

Unique Advantages

• Large, Integrated Logic Fabric: 340,000 logic elements and 128,300 LABs enable implementation of sizable custom logic without extensive external components.
• Substantial On‑Chip Memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for many buffering and stateful applications.
• High I/O Density: 600 I/Os permit flexible board-level integration and support for multiple parallel interfaces or high channel counts.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied in a robust FCBGA package for industrial deployments.
• Controlled Power Envelope: Defined core supply range (820 mV–880 mV) helps simplify power-supply design and system integration.
• Environmental Compliance: RoHS compliant to align with regulatory and manufacturing requirements.

Why Choose 5SGXMA3K3F40I3N?

The 5SGXMA3K3F40I3N positions itself for designs that require a combination of high logic density, significant embedded memory, and large I/O capability within an industrial temperature window. Its Stratix V GX architecture and factory-provided specifications make it suitable for engineers implementing complex, board-level systems that demand on-chip resources and robust operating margins.

For teams building scalable, high‑logic designs where integration, temperature resilience, and a predictable power profile matter, this FPGA provides a clear, specification-driven foundation supported by Intel's Stratix V documentation and device characterization.

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