5SGXMA3K3F40I3LN

The 5SGXMA3K3F40I3LN is a Stratix® V GX series FPGA from Intel, offering a high-density programmable fabric in a 1517-ball BGA (FCBGA) package. This device combines a large logic capacity with substantial on-chip RAM and abundant I/O to address demanding system-level designs.

Targeted at industrial-grade applications, the device provides 340,000 logic elements, approximately 19.5 Mbits of embedded memory, and up to 600 I/O pins, while operating across a core voltage range of 0.82 V to 0.88 V and an ambient temperature range of −40 °C to 100 °C.

Key Features

• Core Logic  340,000 logic elements for high-density programmable logic and complex algorithm implementation.
• Embedded Memory  Approximately 19.5 Mbits of on-chip RAM to support large FIFOs, buffers, and state storage without external SRAM.
• I/O Capacity  Up to 600 user I/O pins to interface with high-channel-count systems, sensors, and peripherals.
• Package & Mounting  1517-BBGA (FCBGA) package, supplier package 1517-FBGA (40×40), designed for surface-mount assembly.
• Power  Core supply voltage specified from 820 mV to 880 mV to match system power delivery and core requirements.
• Temperature & Grade  Industrial grade device rated for operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Compliance  RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

• High-density logic and control systems  Use the large logic element count and embedded RAM for complex control, signal processing, and protocol offload functions.
• High I/O count systems  Leverage 600 I/O pins for multi-channel data acquisition, sensor aggregation, and large peripheral interfaces.
• Industrial and embedded platforms  Industrial temperature rating and surface-mount BGA package enable deployment in rugged embedded equipment and industrial control systems.

Unique Advantages

• High logic density: 340,000 logic elements allow consolidation of multiple functions into a single device, reducing board-level complexity.
• Significant on-chip RAM: Approximately 19.5 Mbits of embedded memory minimizes dependence on external memory for buffering and data paths.
• Large I/O complement: 600 I/O pins support extensive connectivity, simplifying integration with high-channel-count systems.
• Industrial temperature capability: Rated from −40 °C to 100 °C for reliability in thermally challenging environments.
• Compact, manufacturable package: 1517-ball FCBGA in a 40×40 footprint enables high-density board layouts and standard surface-mount assembly.
• Regulatory readiness: RoHS compliance supports environmental and manufacturing regulation requirements.

Why Choose 5SGXMA3K3F40I3LN?

The 5SGXMA3K3F40I3LN positions itself as a high-capacity Stratix V GX FPGA that balances extensive logic resources, substantial embedded memory, and a high I/O count within an industrial-grade, surface-mount BGA package. These attributes make it suitable for engineers designing systems that require integrated logic density, on-chip buffering, and broad I/O connectivity under industrial temperature conditions.

With documented electrical and switching characteristics available for the Stratix V family, this device is appropriate for projects where on-device memory, logic scale, and I/O capacity are key selection criteria.

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