5SGXMA3K3F40C4NCV

The 5SGXMA3K3F40C4NCV is a Stratix V GX Field Programmable Gate Array (FPGA) in a 1517‑BBGA (FCBGA) package designed for high‑density programmable logic implementations. It provides a large logic fabric, substantial embedded memory, and a high I/O count to support complex digital systems and advanced interfacing requirements.

Offered as a commercial‑grade device, this Stratix V GX part is intended for designs that require significant on‑chip resources, tight power supply control, and a surface‑mount BGA package for compact board integration.

Key Features

• Logic Capacity  Approximately 340,000 logic elements to implement large state machines, datapaths, and custom accelerators.
• Embedded Memory  Approximately 19.456 Mbits of embedded memory for buffering, on‑chip data storage, and memory‑intensive logic.
• I/O Density  600 user I/Os to support wide parallel interfaces, mezzanine connectivity, and complex system I/O requirements.
• Package & Mounting  1517‑BBGA (FCBGA) supplier package 1517‑FBGA (40×40) in a surface‑mount format for high‑density board designs.
• Power Supply  Core supply range: 820 mV to 880 mV, enabling designs that require defined low‑voltage core operation.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for standard commercial environment deployments.
• Regulatory Compliance  RoHS compliant.
• Series‑Level Capabilities  Part of the Stratix V GX family; the Stratix V device datasheet documents family electrical and switching characteristics, including published transceiver and speed‑grade options for GX devices.

Typical Applications

• High‑density logic integration  Large custom digital designs that require approximately 340,000 logic elements and substantial on‑chip memory.
• Multi‑lane, high‑I/O systems  Boards requiring up to 600 user I/Os for broad parallel or multi‑interface connectivity.
• Embedded acceleration and data buffering  On‑chip memory (≈19.456 Mbits) for local buffering and scratchpad storage in compute‑intensive tasks.

Unique Advantages

• High logic density:  Approximately 340,000 logic elements enable consolidation of complex functions into a single device, reducing system BOM and board count.
• Significant embedded memory:  Approximately 19.456 Mbits of on‑chip RAM supports large buffers and minimizes external memory bandwidth requirements.
• Large I/O footprint:  600 I/Os provide flexibility for wide buses, multi‑protocol interfaces, and dense connector implementations.
• Compact BGA packaging:  1517‑BBGA (40×40) surface‑mount package allows compact, high‑density board layouts while supporting robust thermal and mechanical mounting.
• Commercial‑grade suitability:  Rated for 0 °C to 85 °C operation for typical commercial applications and deployments.
• Standards‑oriented compliance:  RoHS compliance supports environmentally conscious designs and manufacturing processes.

Why Choose 5SGXMA3K3F40C4NCV?

The 5SGXMA3K3F40C4NCV combines large programmable logic capacity, substantial embedded memory, and a high I/O count in a compact FCBGA package—making it well suited for engineers designing complex digital systems that need on‑chip resources and dense external interfacing. As a member of the Stratix V GX family, it aligns with the series' documented electrical and switching characteristics for commercial‑grade FPGA deployments.

This device is appropriate for development teams targeting high‑capacity FPGA implementations where consolidation, on‑chip buffering, and plentiful I/Os reduce system complexity and bill‑of‑materials. Its defined core voltage range and commercial temperature rating help designers plan power delivery and thermal budgets with precision.

Request a quote or submit an inquiry to obtain pricing, availability, and technical assistance for the 5SGXMA3K3F40C4NCV. Our team can help with lead times, packaging options, and integration considerations specific to your design.