5SGXMA3K3F40C3WN

The 5SGXMA3K3F40C3WN is a Stratix® V GX field programmable gate array (FPGA) in a 1517-ball BGA (FCBGA) package from Intel. It provides a high-capacity programmable fabric with integrated memory and extensive I/O resources for demanding digital designs.

Designed for applications that require advanced I/O timing and transceiver capabilities, this commercial-grade device balances large logic and memory resources with a dense 1517-FBGA (40×40) package and surface-mount assembly for system integration.

Key Features

• Logic Fabric — Approximately 340,000 logic elements and 128,300 logic array blocks (LABs) to implement complex, high-density digital designs.
• Embedded Memory — Approximately 19.46 Mbits of on-chip RAM for buffering, packet storage, and algorithm working memory.
• I/O Capacity — 600 user I/O pins to support extensive peripheral and interface connectivity.
• Transceiver & I/O Timing — Device datasheet covers transceiver specifications and detailed I/O timing, including programmable I/O element delay and programmable output buffer delay for precise interface timing control.
• Power — Core voltage supply range of 820 mV to 880 mV, enabling defined operating conditions for the device core.
• Package & Mounting — 1517-ball BGA FCBGA package (supplier device package: 1517-FBGA, 40×40) with surface-mount mounting type for compact board-level integration.
• Temperature & Grade — Commercial grade device specified for 0 °C to 85 °C operating temperature.
• Standards — RoHS compliant.

Typical Applications

• High-speed serial and transceiver-based systems — Uses the Stratix V GX transceiver capabilities and I/O timing controls to implement multi-gigabit serial links and protocol bridging.
• Custom logic acceleration — Large logic element count and on-chip memory enable offloading and acceleration of compute-intensive algorithms.
• Interface consolidation — High I/O pin count supports dense peripheral connectivity and aggregation of multiple interfaces on a single device.

Unique Advantages

• High logic capacity: Approximately 340,000 logic elements provide room for large, complex designs without immediate device scaling.
• Substantial embedded memory: About 19.46 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs.
• Extensive I/O: 600 I/Os support multiple high-density interfaces and board-level consolidation.
• Programmable I/O timing: Datasheet-defined programmable I/O element and output buffer delays enable precise timing tuning for interface compliance and signal integrity.
• Commercial-grade operation: Specified for 0 °C to 85 °C, suitable for standard commercial electronic systems.
• Compact BGA footprint: 1517-ball FCBGA (40×40) package offers a dense assembly option for space-constrained designs.

Why Choose 5SGXMA3K3F40C3WN?

The 5SGXMA3K3F40C3WN combines a large programmable fabric, significant on-chip RAM, and a high I/O count in a compact 1517-ball FCBGA package. It is positioned for designers who need integrated logic, memory, and precise I/O/transceiver control within commercial-temperature systems.

With datasheet-backed electrical and switching characteristics—including transceiver specifications and programmable I/O timing—this Stratix V GX device is suitable for projects that demand deterministic interface behavior, substantial logic capacity, and dense board integration while maintaining RoHS compliance.

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