5SGXMA3K3F40C2WN

The 5SGXMA3K3F40C2WN is a Stratix® V GX commercial-grade FPGA from Intel, designed for high-density programmable logic applications. It delivers a large logic fabric and substantial on-chip memory combined with a high I/O count, suitable for complex digital systems that require significant integration and configurability.

This device targets designs that need extensive logic capacity, embedded memory, and broad external connectivity while operating within commercial temperature and supply ranges.

Key Features

• Logic Capacity  Approximately 340,000 logic elements for implementing large, complex digital designs and custom hardware acceleration.
• Embedded Memory  Approximately 19.5 Mbits of on-chip RAM to support buffering, packet processing, or scratchpad storage without external memory for many use cases.
• I/O  600 I/O pins to enable extensive peripheral, memory, and high-density board-level interconnects.
• Power Supply  Core voltage supply range of 870 mV to 930 mV to match system power-rail requirements.
• Package & Mounting  1517-BBGA (FCBGA) package, supplier package 1517-FBGA (40×40), surface-mount mounting for modern PCB assembly flows.
• Operating Conditions  Commercial temperature grade rated from 0 °C to 85 °C.
• Standards Compliance  RoHS compliant.
• Series-Level Transceiver Options  Stratix V GX family documentation indicates multiple transceiver and core speed grade options across the series for designers evaluating series capabilities.

Typical Applications

• High-density digital systems  Use the large logic and memory resources to consolidate multiple functions into a single programmable device for space- and cost-constrained designs.
• Networking and communications  High I/O count and the Stratix V GX series' transceiver-capable family characteristics make the device suitable for interface-rich communication endpoints and protocol processing.
• Compute acceleration & signal processing  Deploy the extensive logic fabric and embedded RAM for custom accelerators, DSP pipelines, and packet processing engines.
• Prototyping & system integration  Leverage reprogrammability and high resource density to iterate system-level designs and integrate multiple subsystems on a single FPGA.

Unique Advantages

• High logic density: Approximately 340,000 logic elements enable implementation of large, complex designs without partitioning across multiple devices.
• Substantial embedded memory: Approximately 19.5 Mbits of on-chip RAM reduces dependence on external memory for many buffering and local storage tasks.
• Extensive external connectivity: With 600 I/O pins, the device supports dense board-level interfaces and multiple peripherals or memory channels.
• Commercial operating envelope: Rated for 0 °C to 85 °C, suitable for a wide range of commercial electronic products.
• Payload-friendly package: The 1517-BBGA (40×40) FCBGA package provides a compact, surface-mount solution for high-pin-count applications.
• Regulatory alignment: RoHS compliance supports environmentally responsible manufacturing and integration.

Why Choose 5SGXMA3K3F40C2WN?

The 5SGXMA3K3F40C2WN combines large logic capacity, significant embedded RAM, and a high I/O count in a commercial-grade Stratix V GX FPGA package. It is well suited to engineers and teams building complex, interface-rich systems that benefit from on-device programmability and consolidation of functions.

For projects where scalability, reprogrammability, and a high integration density are priorities, this device offers a balanced platform that aligns with standard commercial temperature and supply requirements while fitting modern surface-mount board designs.

Request a quote or submit an inquiry to learn about availability, lead times, and volume pricing for the 5SGXMA3K3F40C2WN.