5SGXMA3K3F40C2N

The 5SGXMA3K3F40C2N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, provided in a 1517-BBGA (1517-FBGA, 40×40) package for surface-mount assembly. This device delivers a large programmable fabric with 340,000 logic elements and approximately 19.456 Mbits of embedded memory, together with up to 600 general-purpose I/Os.

Designed for commercial-temperature applications, the device operates from 0 °C to 85 °C and requires a core supply in the range of 870 mV to 930 mV. It is RoHS compliant and targeted at designs that require high logic density, significant embedded RAM, and extensive I/O connectivity.

Key Features

• Logic Capacity — 340,000 logic elements to implement complex programmable logic and large-scale digital functions.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive logic blocks.
• I/O Count — Up to 600 programmable I/Os to support high channel counts and broad peripheral interfacing.
• Package and Mounting — 1517-BBGA (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for PCB integration.
• Power Supply — Core voltage specified between 870 mV and 930 mV for power planning and regulator selection.
• Operating Temperature — Commercial grade operation from 0 °C to 85 °C for standard commercial systems.
• Regulatory — RoHS compliant, supporting environmental and solderability requirements for lead-free assembly.

Typical Applications

• High-density digital processing — Implement large combinational and sequential logic networks using the 340,000 logic elements and embedded RAM.
• Multi-channel I/O interfacing — Aggregate and manage numerous parallel or serialized signals using up to 600 I/Os.
• Memory-buffered data paths — Use the approximately 19.456 Mbits of on-chip RAM for buffering, packet queues, or temporary data storage.
• Commercial embedded systems — Integrate into commercial-temperature designs that require surface-mount placement and RoHS compliance.

Unique Advantages

• Large logic fabric: 340,000 logic elements provide the capacity to consolidate multiple functions into a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM enables significant local storage to improve data throughput and reduce external memory dependency.
• High I/O density: 600 I/Os support complex interfaces and high channel-count systems without immediate need for external I/O expanders.
• Commercial-grade thermal window: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial electronics applications.
• Clear power envelope: Defined core voltage range (870–930 mV) simplifies power-supply design and board-level power budgeting.
• RoHS compliant packaging: Meets lead-free assembly requirements for modern manufacturing processes.

Why Choose 5SGXMA3K3F40C2N?

The 5SGXMA3K3F40C2N combines a high logic cell count, substantial embedded memory, and extensive I/O in a surface-mount 1517-BBGA package, offering a compact platform for consolidating complex digital functions. Its commercial temperature rating and defined core-voltage requirements make it straightforward to integrate into commercial embedded systems where logic density and on-chip RAM are primary design drivers.

Backed by Intel’s Stratix V device documentation, the part is suited to engineers and system designers who need measurable capacity and clear electrical/thermal bounds for planning, design, and verification.

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