5SGXMA3K3F40C2LG
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,661 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 128300 | Number of Logic Elements/Cells | 340000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGXMA3K3F40C2LG – Stratix® V GX FPGA, 340,000 logic elements, 600 I/O, 1517-BBGA
The 5SGXMA3K3F40C2LG is a Stratix® V GX family Field Programmable Gate Array (FPGA) device offering high logic density and extensive I/O integration. This commercial‑grade FPGA combines a large number of logic elements, substantial on‑chip RAM, and a 1517‑ball FCBGA package for surface‑mount applications.
Key value attributes are its large programmable fabric, abundant embedded memory, and a high I/O count, making it suited to designs that require dense logic, significant data buffering, and broad external connectivity within a commercial temperature range.
Key Features
- Core and Logic Provides 340,000 logic elements for implementing complex programmable logic and system functions.
- Embedded Memory Includes approximately 19.456 Mbits of on‑chip RAM to support buffering, state storage, and memory‑intensive logic.
- I/O Capacity Up to 600 I/O pins to accommodate wide external interfacing and high‑pin‑count system requirements.
- Power Supply Core supply range specified between 820 mV and 880 mV to match target power delivery designs.
- Package and Mounting Delivered in a 1517‑BBGA (FCBGA) package, supplier device package 1517‑FBGA (40×40), intended for surface‑mount assembly.
- Temperature and Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Standards Compliance RoHS compliant to meet common environmental and manufacturing requirements.
Unique Advantages
- High logic density: 340,000 logic elements enable implementation of complex functions and large‑scale programmable designs without multiple devices.
- Substantial embedded memory: Approximately 19.456 Mbits of on‑chip RAM reduces external memory needs for many buffering and state‑storage tasks.
- Extensive I/O: 600 I/O pins allow broad peripheral and system interconnect options, simplifying board‑level integration.
- Compact system footprint: 1517‑FBGA (40×40) package provides high pin density in a surface‑mount form factor for space‑constrained PCBs.
- Low‑voltage core: 820 mV–880 mV supply range supports modern low‑voltage power architectures.
- Commercial temperature suitability: Rated 0 °C to 85 °C for standard commercial applications and environments.
Why Choose 5SGXMA3K3F40C2LG?
The 5SGXMA3K3F40C2LG positions itself as a high‑density Stratix V GX FPGA option for designs requiring large programmable logic capacity, significant embedded memory, and a high count of I/O in a compact FCBGA package. Its combination of 340,000 logic elements, approximately 19.456 Mbits of on‑chip RAM, and 600 I/O makes it suitable for complex digital systems where integration and routing density matter.
For engineering teams targeting commercial applications within the 0 °C to 85 °C range, this device offers a balance of logic resources, memory, and package density while complying with RoHS requirements. The defined core voltage range and standard FCBGA mounting facilitate integration into modern low‑voltage, surface‑mount PCB designs.
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