5SGXMA3K3F40C2LG

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 1517-BBGA, FCBGA

Quantity 1,661 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXMA3K3F40C2LG – Stratix® V GX FPGA, 340,000 logic elements, 600 I/O, 1517-BBGA

The 5SGXMA3K3F40C2LG is a Stratix® V GX family Field Programmable Gate Array (FPGA) device offering high logic density and extensive I/O integration. This commercial‑grade FPGA combines a large number of logic elements, substantial on‑chip RAM, and a 1517‑ball FCBGA package for surface‑mount applications.

Key value attributes are its large programmable fabric, abundant embedded memory, and a high I/O count, making it suited to designs that require dense logic, significant data buffering, and broad external connectivity within a commercial temperature range.

Key Features

  • Core and Logic  Provides 340,000 logic elements for implementing complex programmable logic and system functions.
  • Embedded Memory  Includes approximately 19.456 Mbits of on‑chip RAM to support buffering, state storage, and memory‑intensive logic.
  • I/O Capacity  Up to 600 I/O pins to accommodate wide external interfacing and high‑pin‑count system requirements.
  • Power Supply  Core supply range specified between 820 mV and 880 mV to match target power delivery designs.
  • Package and Mounting  Delivered in a 1517‑BBGA (FCBGA) package, supplier device package 1517‑FBGA (40×40), intended for surface‑mount assembly.
  • Temperature and Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Standards Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Unique Advantages

  • High logic density: 340,000 logic elements enable implementation of complex functions and large‑scale programmable designs without multiple devices.
  • Substantial embedded memory: Approximately 19.456 Mbits of on‑chip RAM reduces external memory needs for many buffering and state‑storage tasks.
  • Extensive I/O: 600 I/O pins allow broad peripheral and system interconnect options, simplifying board‑level integration.
  • Compact system footprint: 1517‑FBGA (40×40) package provides high pin density in a surface‑mount form factor for space‑constrained PCBs.
  • Low‑voltage core: 820 mV–880 mV supply range supports modern low‑voltage power architectures.
  • Commercial temperature suitability: Rated 0 °C to 85 °C for standard commercial applications and environments.

Why Choose 5SGXMA3K3F40C2LG?

The 5SGXMA3K3F40C2LG positions itself as a high‑density Stratix V GX FPGA option for designs requiring large programmable logic capacity, significant embedded memory, and a high count of I/O in a compact FCBGA package. Its combination of 340,000 logic elements, approximately 19.456 Mbits of on‑chip RAM, and 600 I/O makes it suitable for complex digital systems where integration and routing density matter.

For engineering teams targeting commercial applications within the 0 °C to 85 °C range, this device offers a balance of logic resources, memory, and package density while complying with RoHS requirements. The defined core voltage range and standard FCBGA mounting facilitate integration into modern low‑voltage, surface‑mount PCB designs.

Request a quote or submit an inquiry to receive pricing and availability details for the 5SGXMA3K3F40C2LG.

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