5SGXMA3K3F35I4G

The 5SGXMA3K3F35I4G is an industrial-grade Stratix® V GX family FPGA from Intel (Altera), presented in a 1152-ball FCBGA package. It delivers a high-capacity programmable fabric with 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and 600 user I/Os for designs that require substantial logic, memory, and I/O resources.

This device is suited to applications and systems that demand large-scale logic integration and robust operation across an industrial temperature range (−40 °C to 100 °C). It is offered in a surface-mount 1152-BBGA (35 × 35 mm) package and operates from a core voltage supply between 820 mV and 880 mV.

Key Features

• Core & Logic 340,000 logic elements to implement complex digital logic and custom hardware accelerators.
• Embedded Memory Approximately 19.456 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
• I/O & Package 600 user I/Os in a 1152-BBGA (FCBGA) 35 × 35 mm supplier device package; surface-mount footprint for high-density board designs.
• Power Core voltage supply specified from 820 mV to 880 mV to match system power architectures.
• Temperature & Reliability Industrial temperature grade with operating range −40 °C to 100 °C for deployment in demanding environments.
• Series-Level Transceiver Options As part of the Stratix V GX family, the series datasheet documents GX transceiver speed grades (examples include channel options up to 14.1 Gbps and 12.5 Gbps depending on grade).
• Regulatory RoHS compliant.

Typical Applications

• High-density hardware acceleration — Implement compute-intensive datapath and accelerator functions using the device’s large logic capacity and on-chip RAM.
• Network and packet processing — 600 I/Os and series-level high-speed transceiver options support complex I/O topologies and high-throughput interfaces.
• Prototyping and development of advanced SoC functions — Large programmable fabric and abundant memory enable emulation of system components and subsystem verification.

Unique Advantages

• Large programmable fabric: 340,000 logic elements provide the headroom to implement wide, parallel datapaths and deep pipeline architectures.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for many buffering and LUT needs.
• High I/O density: 600 user I/Os allow flexible interfacing to peripherals, transceivers, and board-level buses without immediate external multiplexing.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in challenging thermal environments.
• Compact BGA package: 1152-BBGA (35 × 35 mm) packaging balances routing density and board-space efficiency for high-performance systems.
• RoHS compliant: Meets common regulatory requirements for lead-free assembly.

Why Choose 5SGXMA3K3F35I4G?

The 5SGXMA3K3F35I4G positions itself as a high-capacity, industrial-grade FPGA option within the Stratix V GX family, combining a large logic element count, substantial embedded memory, and a high I/O count in a 1152-ball FCBGA package. These attributes make it a strong candidate for designs that need dense logic implementation, significant on-chip RAM, and flexible interfacing while operating across a wide temperature range.

Backed by Intel’s Stratix V family documentation and silicon heritage, this device supports designers requiring scalability and robustness for advanced digital systems, prototyping, and high-performance I/O-centric applications.

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