5SGXMA3K3F35I3N

The 5SGXMA3K3F35I3N is a Stratix V GX family FPGA in a 1152‑ball FCBGA package, designed for high-density programmable logic implementations. This device combines 340,000 logic elements with approximately 19.46 Mbits of on‑chip RAM and up to 600 I/O pins to address complex, I/O‑rich designs.

Electrical and switching characteristics for the Stratix V family — including operating conditions and power — are documented in the device datasheet for design and system integration reference.

Key Features

• Core Logic Density  Approximately 340,000 logic elements provide large on‑chip programmable logic capacity for complex algorithms and parallel processing.
• Embedded Memory  Approximately 19.46 Mbits of embedded RAM for buffering, FIFOs, and data‑path storage within the FPGA fabric.
• I/O Capability  Up to 600 user I/O pins support dense external connectivity and multiple peripheral interfaces.
• Package  1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA (35×35) for compact, high‑pin‑count board integration.
• Low‑Voltage Core  Core supply range of 820 mV to 880 mV to match low‑voltage FPGA core domains.
• Operating Temperature  Industrial temperature grade with rated operation from −40 °C to 100 °C for deployment in thermally demanding environments.
• Mounting  Surface‑mount package suitable for modern PCB assembly flows.
• RoHS Compliance  Device is RoHS compliant.

Typical Applications

• High‑density logic designs  Systems that require substantial programmable logic and on‑chip memory capacity, leveraging the device's 340,000 logic elements and ~19.46 Mbits of RAM.
• I/O‑intensive systems  Applications needing extensive external connectivity can utilize the device's up to 600 I/O pins for parallel interfaces and multiple peripherals.
• Industrial temperature deployments  Equipment operating across a wide temperature range can benefit from the device's −40 °C to 100 °C rating.

Unique Advantages

• High programmable capacity: 340,000 logic elements enable partitioning of complex functions into a single device, reducing cross‑device interconnect complexity.
• Substantial embedded memory: Approximately 19.46 Mbits of on‑chip RAM supports large buffering and on‑chip data storage without immediate external memory dependence.
• Large I/O count: Up to 600 I/O pins simplify board routing for multi‑interface designs and reduce the need for external I/O expanders.
• Compact, high‑pin package: The 1152‑ball FCBGA footprint delivers high pin density for space‑constrained PCBs while maintaining signal routing options.
• Industrial temperature rating: Designed for reliable operation across −40 °C to 100 °C, supporting deployments in harsher thermal environments.
• Documented electrical/switching characteristics: Stratix V family datasheet provides the device electrical and switching parameters necessary for system design and power budgeting.

Why Choose 5SGXMA3K3F35I3N?

The 5SGXMA3K3F35I3N positions itself as a high‑density Stratix V GX FPGA option for designers who need extensive logic resources, substantial on‑chip RAM, and a high I/O count in a compact FCBGA package. Its industrial temperature rating and documented electrical characteristics make it suitable for demanding embedded and board‑level designs that must manage power, I/O capacity, and thermal constraints.

This device is appropriate for engineering teams seeking a scalable, high‑capacity FPGA building block where on‑chip memory, logic density, and I/O availability are key selection criteria.

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