5SGXMA3K3F35I4N

IC FPGA 600 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 1152-BBGA, FCBGA

Quantity 277 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXMA3K3F35I4N – Stratix® V GX FPGA, 340,000 logic elements, 600 I/Os

The 5SGXMA3K3F35I4N is an Intel Stratix V GX field programmable gate array (FPGA) offered in an industrial temperature grade. It delivers high logic density and substantial on-chip memory in a 1152-ball FCBGA package intended for demanding embedded and communications designs.

With 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and up to 600 user I/Os, this device targets applications that require large programmable fabric, extensive I/O routing, and industrial operating range.

Key Features

  • Core Logic 340,000 logic elements (cells) provide significant programmable fabric for complex digital designs and custom logic implementations.
  • Embedded Memory Approximately 19.456 Mbits of on-chip RAM to support buffering, data storage, and memory-intensive algorithms without external memory for many designs.
  • I/O Density Up to 600 user I/Os to enable rich peripheral connectivity, broad bus interfaces, and multi-channel system integration.
  • Transceiver and Series Capabilities Part of the Stratix V GX family; the series datasheet documents transceiver speed grades and I/O timing characteristics for high-speed communications designs.
  • Power and Voltage Core voltage supply range specified at 820 mV to 880 mV, allowing designs to target the device’s core power requirements precisely.
  • Package and Mounting 1152-BBGA (FCBGA) package, supplier device package 1152-FBGA (35×35), designed for surface-mount assembly on compact, high-density boards.
  • Industrial Temperature Range Rated for operation from –40°C to 100°C to meet elevated environmental and reliability demands in industrial applications.
  • RoHS Compliance Device is RoHS-compliant for regulatory and environmental considerations.

Typical Applications

  • High-speed communications — Large I/O count and Stratix V GX transceiver capabilities suit multi‑lane networking equipment and protocol bridging where high-bandwidth links and programmable logic are required.
  • Signal processing and acceleration — Dense logic and substantial embedded RAM enable hardware acceleration, DSP pipelines, and custom data-path implementations.
  • Industrial control systems — Industrial temperature rating and robust I/O support make this FPGA suitable for complex motor control, automation controllers, and real-time processing in harsh environments.
  • Prototyping and system integration — High logic capacity and I/O flexibility allow system architects to integrate multiple functions onto a single device and validate complex system designs.

Unique Advantages

  • High logic capacity: 340,000 logic elements accommodate large, multi-function designs without immediate need for multiple devices.
  • Substantial embedded memory: Approximately 19.456 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage tasks, simplifying board design.
  • Extensive I/O options: 600 I/Os provide flexibility for connecting to multiple peripherals, parallel interfaces, and high-channel-count systems.
  • Industrial-grade operation: –40°C to 100°C operating range supports deployment in industrial environments with elevated temperature requirements.
  • Compact, high-density packaging: 1152-ball FCBGA (35×35) package enables dense board placement while preserving signal routing capabilities.
  • Controlled core voltage: 820–880 mV supply range allows precise power planning for the device core in system designs.

Why Choose 5SGXMA3K3F35I4N?

The 5SGXMA3K3F35I4N combines high programmable logic capacity, considerable embedded memory, and a large complement of I/Os in an industrial‑rated Stratix V GX FPGA. It is well suited for engineers designing high-performance communications, signal processing, and industrial control systems who need a single-device solution with extensive resources and predictable electrical and thermal characteristics.

Choosing this FPGA supports scalable designs that leverage the Stratix V family’s documented electrical and transceiver characteristics, enabling system-level integration and long-term maintainability in industrial deployments.

Request a quote or submit an inquiry to receive pricing, availability, and technical assistance for the 5SGXMA3K3F35I4N FPGA. Our team can help with procurement details and support for your design evaluation.

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