5SGXMA3K3F35I3LN

The 5SGXMA3K3F35I3LN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel designed for high-density, industrial-grade digital designs. It combines a large logic fabric with substantial on-chip memory and a broad I/O count to support complex system integration.

Key device attributes include 340,000 logic elements, approximately 19.456 Mbits of embedded RAM, up to 600 user I/Os, an industrial operating range of −40 °C to 100 °C, and a compact 1152-BBGA (35 × 35 mm) FCBGA package. The device operates from a core voltage supply between 820 mV and 880 mV and is intended for surface-mount PCB assembly.

Key Features

• Logic Capacity — 340,000 logic elements to implement large-scale combinational and sequential logic functions.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM for buffering, state storage, and local data handling.
• High I/O Count — 600 user I/Os enabling extensive external connectivity and parallel interfacing with peripherals and data paths.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
• Power Envelope — Core supply range of 820 mV to 880 mV, allowing precise power provisioning for the FPGA core.
• Package and Mounting — 1152-BBGA (FCBGA) 35 × 35 mm package optimized for surface-mount assembly and dense PCB layouts.
• Standards Compliance — RoHS compliant, meeting common environmental requirements for electronic components.

Typical Applications

• High-density digital systems — Implement large combinational and sequential logic functions using 340,000 logic elements and on-chip RAM for local buffering.
• Data and I/O intensive designs — Leverage 600 user I/Os for multi-channel interfacing, parallel buses, and complex external device connectivity.
• Industrial control and automation — Industrial temperature rating (−40 °C to 100 °C) and robust packaging make it suitable for control systems and automated machinery.
• System integration and prototyping — Dense logic and memory resources support integration of multiple functions into a single programmable device for rapid development.

Unique Advantages

• High logic density: 340,000 logic elements enable consolidation of complex functions and reduce the need for multiple discrete devices.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM supports local data storage and lowers external memory dependency.
• Extensive external connectivity: 600 I/Os provide flexibility for parallel interfaces, multiple peripherals, and high-channel-count designs.
• Industrial-rated reliability: Operation from −40 °C to 100 °C supports deployment in harsh and temperature-variable environments.
• Compact FCBGA package: The 1152-BBGA (35 × 35 mm) footprint enables high-density board designs while maintaining robust soldered connections.

Why Choose 5SGXMA3K3F35I3LN?

The 5SGXMA3K3F35I3LN positions itself as a high-capacity, industrial-grade Stratix® V GX FPGA suited for applications requiring large programmable logic arrays, significant on-chip memory, and broad I/O resources. Its combination of 340,000 logic elements, approximately 19.456 Mbits of RAM, and 600 I/Os makes it appropriate for system consolidation and designs that demand extensive interfacing and local data handling.

Designed in a 1152-BBGA FCBGA package with a core voltage range of 820 mV to 880 mV and certified RoHS compliance, this device supports engineers and procurement teams seeking a scalable, reliable FPGA foundation for long-term deployments under industrial conditions.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the 5SGXMA3K3F35I3LN.