5SGXMA3K3F35I3G

The 5SGXMA3K3F35I3G is an Intel Stratix V GX family FPGA supplied in a 1152-ball FCBGA package. It delivers a large programmable fabric—340,000 logic elements—and extensive on-chip RAM for complex, high-density digital designs.

With 600 user I/O pins, an industrial operating temperature range, and a low-voltage core supply window, this device is suited to demanding embedded, communications and industrial applications that require high integration and robust thermal performance.

Key Features

• Core Logic: 340,000 logic elements for implementing large, complex logic networks and state machines.
• Embedded Memory: Approximately 19.456 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive algorithms.
• I/O Density: 600 user I/O pins to enable broad connectivity for high-pin-count systems and multi-channel interfaces.
• Package & Mounting: 1152-BBGA (1152-FBGA, 35×35) surface-mount package for high-density board integration and scalable pinout options.
• Power Supply: Core supply range of 820 mV to 880 mV to support targeted low-voltage core operation.
• Operating Range: Industrial temperature rating from −40 °C to 100 °C for deployment in thermally demanding environments.
• Standards & Compliance: RoHS-compliant manufacturing.
• Family Characteristics: Part of the Stratix V GX series; Stratix V devices are offered in commercial and industrial temperature grades, and GX devices include transceiver speed-grade offerings as described in the Stratix V device documentation.

Typical Applications

• Telecommunications & Networking: Implement high-density packet processing, protocol bridging, and multi-channel I/O aggregation using the device’s large logic fabric and abundant I/O.
• Data Acceleration & Storage Systems: Use on-chip RAM and extensive logic resources for data buffering, custom accelerators, and interface control in high-throughput systems.
• Industrial Control & Automation: Deploy in industrial equipment where the −40 °C to 100 °C operating range and high I/O count support rugged control, signal conditioning, and multi-sensor connectivity.
• Test, Measurement & Instrumentation: Leverage dense logic and large embedded memory for real-time signal processing, capture, and analysis functions.

Unique Advantages

• High integration density: 340,000 logic elements reduce the need for multiple devices by consolidating complex functions into a single FPGA.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM supports large buffers and stateful processing without external memory dependence.
• Extensive I/O capability: 600 I/Os enable direct interfacing to many peripherals, lanes, and external devices, simplifying board-level design.
• Industrial temperature operation: Rated from −40 °C to 100 °C for reliable performance in harsh thermal environments.
• Compact high-ball-count package: 1152-ball FCBGA (35×35) provides a dense pinout for high-pin-count designs while maintaining a surface-mount form factor.
• Low-voltage core operation: Core supply range of 820 mV–880 mV supports designs targeting lower core power domains.

Why Choose 5SGXMA3K3F35I3G?

The 5SGXMA3K3F35I3G positions itself as a high-capacity Stratix V GX FPGA delivering a combination of dense logic, substantial embedded memory, and wide I/O resources in a single 1152-ball FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-lived deployments in demanding environments.

This device is a fit for engineering teams building complex, high-throughput systems that require integrated logic and memory on a single device—reducing board complexity and streamlining system design while leveraging the Stratix V family’s documented characteristics and grade offerings.

Request a quote or submit your project details to receive pricing and availability information for the 5SGXMA3K3F35I3G. Our team will respond with lead-time and procurement options tailored to your requirements.