5SGXMA3K3F35C3WN

The 5SGXMA3K3F35C3WN is a Stratix V GX field programmable gate array (FPGA) IC from Intel (Altera). It provides a high-density programmable logic fabric with substantial on-chip RAM and a large I/O count in a surface-mount FCBGA package.

Designed for applications that require large-scale logic integration, abundant embedded memory, and extensive I/O, this commercial-grade Stratix V GX device targets complex system designs where integration and scalability are priorities.

Key Features

• Logic Capacity  Approximately 340,000 logic elements for implementing large combinational and sequential logic designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, packet memory, and complex state machines.
• I/O Count  600 general-purpose I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package  1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) optimized for surface-mount PCB assembly.
• Power  Core supply voltage specified from 820 mV to 880 mV, enabling low-voltage core operation.
• Operating Temperature  Commercial temperature grade rated from 0 °C to 85 °C for standard temperature-range deployments.
• Mounting Type  Surface mount package suitable for modern PCB assembly processes.
• Compliance  RoHS compliant.

Typical Applications

• High‑density FPGA designs  Use the large logic fabric and on-chip RAM to consolidate multiple functions into a single programmable device.
• Networking and communications equipment  Leverage the high I/O count and Stratix V GX family capabilities to implement packet processing, protocol bridging, and data-plane functions.
• Data processing and acceleration  Deploy the device where substantial programmable logic and embedded memory are required for custom data-path and acceleration tasks.

Unique Advantages

• High logic density: Approximately 340,000 logic elements enable complex, large-scale designs without immediate partitioning across multiple devices.
• Substantial on-chip RAM: Approximately 19.456 Mbits of embedded memory reduces external memory dependence for buffering and state storage.
• Extensive I/O resources: 600 I/O pins provide flexibility for wide buses, multi-channel interfaces, and parallel peripheral connectivity.
• Compact, production-ready package: 1152-BBGA (35×35) FCBGA surface-mount package supports dense PCB layouts and automated assembly.
• Commercial temperature rating: Specified 0 °C to 85 °C operation for standard commercial deployments.
• Documented device family: Part of the Stratix V GX family with available device documentation covering electrical and switching characteristics.

Why Choose 5SGXMA3K3F35C3WN?

The 5SGXMA3K3F35C3WN combines large programmable logic capacity, meaningful on-chip RAM, and a high I/O complement in a single surface-mount Stratix V GX device. Its commercial temperature rating, low-voltage core operation range, and RoHS compliance make it suitable for production designs that require integration and scalability.

This device is appropriate for engineering teams building complex systems that benefit from consolidating functionality into one FPGA while relying on the Stratix V family documentation for detailed electrical and switching characteristics.

Request a quote or submit an inquiry for pricing and availability to begin evaluating the 5SGXMA3K3F35C3WN for your next design.