5SGXMA3K3F35C2N

The 5SGXMA3K3F35C2N is a Stratix V GX family FPGA from Intel, delivered in a 1152‑BBGA (1152‑FBGA, 35×35) surface‑mount package for commercial applications. It combines high logic density, substantial embedded memory, and extensive I/O to address complex digital processing, communications, and high‑I/O integration tasks.

Designed as part of the Stratix V device family, this GX device aligns with device datasheet characteristics for transceiver, core and periphery switching, and I/O timing as defined for Stratix V GX devices.

Key Features

• Logic Capacity  Approximately 340,000 logic elements for implementing large-scale custom digital functions.
• Embedded Memory  Approximately 19.46 Mbits of on‑chip RAM to support buffering, FIFOs, and intermediate storage without external memory.
• I/O Density  600 I/O pins providing broad external connectivity for interfaces, peripherals, and board‑level integration.
• Power Supply  Validated core supply range of 870 mV to 930 mV to match system power domain requirements described for the device.
• Package & Mounting  1152‑BBGA / 1152‑FBGA (35×35) footprint; surface‑mount package suitable for compact, high‑density PCBs.
• Operating Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Series Capabilities  Stratix V GX family device characteristics include documented transceiver and I/O timing features in the Stratix V datasheet.
• Regulatory  RoHS compliant.

Typical Applications

• Communications & Networking  High I/O count and Stratix V GX family transceiver capabilities make this device suitable for network interface functions and protocol bridging in commercial systems.
• High‑Density Digital Processing  Large logic element count and on‑chip RAM support complex custom logic, packet processing, and control plane implementations.
• Prototyping & Systems Integration  The 1152‑BBGA package and broad I/O enable integration into evaluation platforms and dense system boards for proof‑of‑concept and product development.

Unique Advantages

• High logic density: Approximately 340,000 logic elements reduce the need for multiple devices and simplify system partitioning.
• Substantial embedded memory: About 19.46 Mbits of on‑chip RAM lowers dependence on external memory for intermediate storage and buffering.
• Extensive I/O: 600 I/Os provide flexibility for interfacing multiple peripherals, high‑pin‑count connectors, and board‑level routing.
• Commercial temperature suitability: Rated 0 °C to 85 °C for use in commercial environments where that temperature range is required.
• Compact package: 1152‑FBGA (35×35) surface‑mount package enables dense PCB designs while maintaining high pin count.
• Standards‑aligned family features: As a Stratix V GX device, it adheres to the family’s defined electrical and switching characteristics, including transceiver and I/O timing capabilities documented in the datasheet.

Why Choose 5SGXMA3K3F35C2N?

The 5SGXMA3K3F35C2N positions itself as a high‑capacity, commercially graded FPGA for designs that require substantial logic resources, on‑chip memory, and a large number of I/Os in a compact BGA package. It is well suited for engineers developing complex digital systems, communications interfaces, and high‑integration boards where on‑chip resources and package density matter.

Backed by the Stratix V family specifications, this device offers predictable electrical and switching characteristics for integration into commercial products and development platforms, providing a clear path for scalable designs that leverage Intel’s Stratix V device documentation.

Request a quote or submit a pricing and availability inquiry to evaluate 5SGXMA3K3F35C2N for your next design.