5SGXMA3K3F35C2LG

The 5SGXMA3K3F35C2LG is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel. It integrates approximately 340,000 logic elements and approximately 19.456 Mbits of embedded memory, with 600 I/Os in a 1152-BBGA (35×35) FCBGA package for surface-mount assembly.

This part is specified as commercial grade and is documented within the Stratix V device datasheet for electrical and switching characteristics. Key operational parameters include a core voltage supply range of 820 mV to 880 mV and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic Capacity  Approximately 340,000 logic elements provide substantial programmable fabric for complex designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM (Total Ram Bits: 19,456,000) to support data buffering and state storage without immediate reliance on external memory.
• I/O Resources  600 I/Os enabling extensive peripheral connectivity and board-level interfacing.
• Package & Mounting  1152-BBGA (FCBGA) supplier device package, 35×35mm footprint, designed for surface-mount PCB assembly.
• Voltage Supply  Core voltage supply range specified between 820 mV and 880 mV.
• Operating Temperature  Commercial temperature grade specified for 0 °C to 85 °C operation.
• Electrical and Switching Documentation  Device electrical and switching characteristics, including transceiver specifications and I/O timing, are covered in the Stratix V device datasheet.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-speed serial communications  Stratix V GX device families include documented transceiver speed grades; this device supports high-speed serial channel implementations as described in the device documentation.
• High-density logic and custom processing  Large logic element count and on-chip RAM capacity enable complex logic functions and hardware acceleration in commercial systems.
• Interface-rich system integration  A 600 I/O count supports multiple peripheral interfaces and flexible board-level integration for systems requiring broad connectivity.

Unique Advantages

• High logic density:  Approximately 340,000 logic elements provide the capacity needed for complex programmable designs.
• Significant embedded memory:  Approximately 19.456 Mbits of on-chip RAM reduces dependence on external memory for many applications.
• Extensive I/O count:  600 I/Os allow for broad interfacing options and flexible signal routing.
• Compact, surface-mount package:  1152-FBGA (35×35) packaging supports space-efficient board-level integration.
• Commercial operating range and low-voltage core:  Specified for 0 °C to 85 °C with a core supply range of 820–880 mV for commercial deployments.
• RoHS compliant:  Meets environmental compliance expectations for commercial products.

Why Choose 5SGXMA3K3F35C2LG?

The 5SGXMA3K3F35C2LG provides a high-capacity Stratix V GX FPGA fabric in a compact 1152-BBGA package, combining large logic element counts, substantial embedded memory, and extensive I/O density for demanding commercial applications. Its documented electrical and switching characteristics make it suitable for designs that require detailed transceiver and I/O timing information.

This Intel Stratix V GX commercial-grade device is appropriate for designers building complex programmable logic solutions that need on-chip memory, numerous I/Os, and a compact surface-mount package while operating within a 0 °C to 85 °C environment.

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