5SGXMA3K3F35C2G

The 5SGXMA3K3F35C2G is a Stratix V GX family FPGA offering high logic density and abundant on-chip memory for complex digital designs. It combines approximately 340,000 logic elements with roughly 19.456 Mbits of embedded RAM to support large-scale fabric implementations and memory‑intensive algorithms.

Designed as a commercial‑grade, surface‑mount device in a 1152‑FBGA (35×35) package, this part provides 600 I/O pins and operates over a supply range of 870 mV to 930 mV with an ambient operating range of 0°C to 85°C. RoHS compliance is included.

Key Features

• Core Logic  Approximately 340,000 logic elements provide the programmable fabric needed for complex state machines, custom accelerators, and high-density combinational logic.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without immediate external memory dependence.
• I/O Capacity  600 accessible I/O pins support broad interfacing options for parallel buses, GPIO, and multi‑lane connectivity.
• Power Supply  Core voltage supply range from 870 mV to 930 mV to match targeted power-domain requirements.
• Package & Mounting  1152‑FBGA (35×35) FCBGA package in a surface‑mount form factor for compact board integration and high pin count routing.
• Operating Grade & Temperature  Commercial temperature grade with an operating range of 0°C to 85°C suitable for standard commercial applications.
• Regulatory Compliance  RoHS compliant to support environmentally conscious designs.

Unique Advantages

• High logic density: The large count of logic elements enables implementation of complex logic, parallel datapaths, and multi-function systems on a single device, reducing the need for multiple FPGAs.
• Significant on-chip RAM: Nearly 19.456 Mbits of embedded memory allows substantial local buffering and data processing close to logic, minimizing external memory traffic.
• Extensive I/O resources: With 600 I/Os, the device supports wide interfaces and high connector counts without immediate need for I/O expanders.
• Compact, high‑pin package: The 1152‑FBGA (35×35) package delivers high pin density in a manageable footprint for dense system boards.
• Commercial readiness: Commercial temperature rating and RoHS compliance simplify adoption for mainstream electronics and production environments.
• Surface-mount integration: The FCBGA surface-mount format is compatible with standard PCB assembly processes for streamlined manufacturing.

Why Choose 5SGXMA3K3F35C2G?

The 5SGXMA3K3F35C2G positions itself as a high‑capacity Stratix V GX FPGA option where large logic fabric, substantial embedded memory, and extensive I/O are required in a single commercial‑grade device. Its combination of approximately 340,000 logic elements, roughly 19.456 Mbits of on‑chip RAM, and 600 I/Os makes it suitable for advanced digital processing tasks and dense interfacing requirements.

Designed for teams that need scalability and integration in commercial applications, this device supports compact system layouts thanks to its 1152‑FBGA package and surface‑mount mounting, while meeting RoHS environmental requirements for production deployment.

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