5SGXMA3K2F40I3WN

The 5SGXMA3K2F40I3WN is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel. It is a high-density, I/O-rich FPGA offering a large logic capacity and substantial on-chip memory targeted at industrial-grade applications.

Key attributes include 340,000 logic elements, approximately 19.46 Mbits of embedded memory, up to 600 I/Os, and support for industrial operating temperatures. The device is supplied in a 1517-BBGA FCBGA package and is RoHS compliant.

Key Features

• Logic Capacity — 340,000 logic elements for implementing complex digital designs and high-density logic integration.
• Embedded Memory — Approximately 19.46 Mbits of on-chip RAM for buffering, FIFOs, and state storage.
• I/O Resources — Up to 600 I/Os to support extensive interfacing and multi-channel connectivity.
• Power and Core Voltage — Core supply operating range from 0.820 V to 0.880 V to match specified power rails.
• Package and Mounting — 1517-BBGA (1517-FBGA, 40×40) FCBGA package; surface mountable for standard PCB assembly processes.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.
• Standards Compliance — RoHS compliant, supporting regulatory requirements for lead-free assemblies.
• Series-Level Documentation — Part of the Stratix V GX family; series datasheet provides electrical and switching characteristics and device operating conditions.

Typical Applications

• High-density FPGA designs — Leverage 340,000 logic elements and extensive on-chip RAM to implement large-scale digital logic and custom accelerators.
• I/O-intensive systems — Use up to 600 I/Os for complex board-level interfacing, multi-protocol bridging, and dense peripheral connectivity.
• Industrial equipment — Industrial temperature rating (−40 °C to 100 °C) makes this FPGA suitable for systems that require extended thermal tolerance.

Unique Advantages

• Substantial logic density: 340,000 logic elements enable integration of large designs and consolidation of multiple functions into a single device.
• Significant on-chip memory: Approximately 19.46 Mbits of embedded RAM reduces external memory dependency and simplifies board design.
• Extensive I/O count: Up to 600 I/Os provide flexibility for multi-channel interfaces and complex system integration.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in demanding environments.
• Compact, surface-mount package: 1517-BBGA (1517-FBGA, 40×40) FCBGA packaging supports high-density PCB layouts and surface-mount assembly.
• Regulatory friendliness: RoHS compliance simplifies qualification for lead-free manufacturing processes.

Why Choose 5SGXMA3K2F40I3WN?

The 5SGXMA3K2F40I3WN positions itself as a high-capacity, industrial-grade Stratix V GX FPGA that balances large logic resources, substantial embedded memory, and broad I/O capability. Its specified core voltage range and surface-mount 1517-BBGA package support modern power-optimized board designs while maintaining rugged operating temperature limits.

This device is suited for engineering teams designing dense digital systems and I/O-heavy applications that require on-chip memory and industrial temperature performance, and who rely on Intel's Stratix V series documentation for electrical and switching characteristics.

To request a quote or submit a procurement inquiry for the 5SGXMA3K2F40I3WN, please request pricing and availability from your preferred supplier or distributor.