5SGXMA3K2F40I3N

The 5SGXMA3K2F40I3N is an Intel Stratix V GX field programmable gate array supplied in a 1517-BBGA FCBGA package. It provides a high-density FPGA fabric with substantial embedded memory and a large I/O count for demanding industrial applications.

This device is offered in an industrial temperature grade and is designed for surface-mount assembly with a core supply range of 820 mV to 880 mV, enabling integration into systems that require extended temperature operation and compact BGA packaging.

Key Features

• Core logic density  Approximately 340,000 logic elements provide significant programmable logic resources for complex digital designs.
• Embedded memory  Approximately 19.456 Mbits of on-chip RAM to support large buffers, FIFOs, and on-chip data storage.
• I/O capacity  Up to 600 user I/O pins to support broad external device connectivity and high-pin-count system interfaces.
• Package and mounting  1517-BBGA (FCBGA) package with supplier device package listed as 1517-FBGA (40×40); designed for surface-mount PCB assembly.
• Power supply  Core voltage specified from 820 mV to 880 mV to match system power-rail planning and thermal design considerations.
• Industrial temperature grade  Rated for operation from −40 °C to 100 °C for use in temperature-challenging environments.
• Regulatory status  RoHS compliant.

Typical Applications

• High-speed serial communications  Series-level Stratix V GX transceiver capabilities (as described in the device family documentation) make this device suitable for designs that require high-throughput serial links and protocol bridging.
• Industrial control and automation  Industrial temperature grading and robust I/O density support control systems, motor drives, and factory automation equipment.
• Data processing and buffering  Large on-chip RAM and high logic density enable packet buffering, data aggregation, and custom datapath implementations in networking and processing nodes.

Unique Advantages

• High programmable capacity:  Approximately 340,000 logic elements reduce the need for multiple devices and simplify partitioning of large designs.
• Substantial on-chip memory:  Approximately 19.456 Mbits of embedded RAM supports deep buffering and complex state machines without external memory.
• Extensive I/O resources:  600 I/O pins provide flexibility for wide buses, multiple interfaces, and mixed-signal front-end connectivity.
• Industrial temperature resilience:  Rated from −40 °C to 100 °C to meet the thermal demands of industrial deployments.
• Compact BGA packaging:  1517-BBGA/1517-FBGA (40×40) packaging offers a dense footprint for space-constrained PCBs while supporting high pin-count routing.
• Low-voltage core operation:  Core supply range of 820 mV–880 mV enables designs optimized for modern low-voltage power domains.

Why Choose 5SGXMA3K2F40I3N?

The 5SGXMA3K2F40I3N balances high logic capacity, substantial embedded memory, and a large I/O complement in a compact FCBGA package rated for industrial temperatures. Its specifications make it well suited for customers building complex digital systems that require on-chip storage, extensive I/O connectivity, and reliable operation across a wide temperature range.

Engineers seeking a robust Stratix V GX family device for demanding industrial or communications-focused projects will find this part aligned with scalable system designs and long-term deployment needs, backed by Intel’s Stratix V device documentation.

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