5SGXMA3K2F40I2WN

The 5SGXMA3K2F40I2WN is an Intel Stratix® V GX field-programmable gate array (FPGA) device offering very large logic capacity and a high I/O count in a compact FCBGA package. It combines 340,000 logic elements with approximately 19.456 Mbits of on-chip RAM and 128,300 logic array blocks to support dense, complex designs.

Specified for industrial operation, this device supports a wide operating temperature range and a tightly controlled core voltage supply, making it suitable for demanding embedded and industrial applications that require extensive logic, memory, and I/O resources in a surface-mount, ball-grid package.

Key Features

• Core Logic  340,000 logic elements and 128,300 logic array blocks provide high-density programmable logic for complex designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support data buffering, FIFOs, and on-chip storage.
• I/O Capacity  600 I/O pins to enable extensive board-level connectivity and system integration.
• Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40); surface-mount mounting for compact PCB implementation.
• Power  Core voltage supply range specified at 870 mV to 930 mV to match system power delivery requirements.
• Temperature & Grade  Industrial grade device with an operating temperature range of –40 °C to 100 °C for deployment in challenging environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital systems  Use the large logic and memory resources to implement complex FPGA-based processing, control, or glue logic functions.
• Communications and networking  High I/O count and the Stratix V GX family’s transceiver support (see device datasheet) make this device suitable for demanding networking and interface tasks.
• Industrial control and automation  Industrial temperature grade and robust package options support deployment in factory and industrial environments requiring long-term reliability.

Unique Advantages

• High integration density: Consolidate logic and memory-heavy functions into a single FPGA with 340,000 logic elements and ~19.456 Mbits of RAM to reduce board-level BOM and complexity.
• Extensive I/O: 600 I/O pins simplify external device interfacing and board routing for multi-protocol systems.
• Industrial robustness: Rated for –40 °C to 100 °C operation to meet the needs of industrial deployments.
• Compact, manufacturable package: 1517-BBGA FCBGA in a 40×40 footprint supports high-density PCB layouts while using standard surface-mount assembly.
• Controlled core power window: Narrow voltage supply range (870–930 mV) enables predictable power design and management.
• Regulatory compliance: RoHS compliance supports environmentally regulated product requirements.

Why Choose 5SGXMA3K2F40I2WN?

The 5SGXMA3K2F40I2WN provides a balanced combination of very large logic capacity, substantial on-chip memory, and a high I/O count in a compact FCBGA package targeted at complex, industrial-grade FPGA implementations. Its specification set supports designers who need to consolidate functions, reduce component count, and maintain reliable operation across a wide temperature range.

This device is suitable for teams developing dense digital processing, high-throughput networking interfaces, or industrial control systems that require strong on-chip resources and a manufacturable package footprint. The Stratix V GX family datasheet contains detailed electrical and switching characteristics for integration and system design.

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