5SGXMA3K2F40I2N

The 5SGXMA3K2F40I2N is an Intel Stratix® V GX field-programmable gate array (FPGA) in a 1517-ball FCBGA package. This industrial-grade device provides large programmable logic capacity, substantial embedded RAM, and a high I/O count for complex system integration.

Designed for applications that require high-density logic, substantial on-chip memory, and robust I/O connectivity, the device is specified for surface-mount assembly and rated for extended temperature operation from −40 °C to 100 °C.

Key Features

• Logic Capacity  Approximately 340,000 logic elements to implement large-scale digital designs and complex custom algorithms.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, packet storage, and intermediate data structures.
• I/O Density  600 user I/O pins to support wide parallel interfaces, multiple peripherals, and high-pin-count system designs.
• Power Supply  Core voltage specified between 870 mV and 930 mV for predictable power planning and regulation on-board.
• Package and Mounting  1517-BBGA (FCBGA) package—supplier package listed as 1517-FBGA (40×40)—optimized for surface-mount PCB assembly.
• Temperature Grade  Industrial-grade device with operating range from −40 °C to 100 °C for deployment in demanding environments.
• RoHS Compliance  Device is RoHS compliant for environmental and regulatory conformity in applicable regions.

Typical Applications

• High-performance Networking  Large logic capacity and abundant I/O make the device suitable for packet-processing, switch fabrics, and line-card functions.
• Telecommunications Infrastructure  On-chip RAM and extensive I/O support buffering and complex protocol handling in base stations and backhaul equipment.
• Compute Acceleration  Programmable logic resources enable custom data-path acceleration, offload engines, and algorithm prototyping.
• Industrial Control Systems  Industrial temperature rating and high I/O count support robust control, monitoring, and motor-drive interfacing.

Unique Advantages

• Large Programmable Resource Pool: Approximately 340,000 logic elements provide capacity for complex FPGA designs without external logic expansion.
• Significant On-Chip Memory: Roughly 19.456 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
• High I/O Count: 600 I/O pins allow flexible partitioning of interfaces and support for parallel connectivity and wide buses.
• Industrial Temperature Range: Rated −40 °C to 100 °C for deployment in environments with wide temperature swings.
• Compact FCBGA Packaging: 1517-ball FCBGA (40×40) package enables dense PCB layouts and surface-mount assembly.
• Regulatory Readiness: RoHS-compliant construction aligns with common environmental requirements.

Why Choose 5SGXMA3K2F40I2N?

The 5SGXMA3K2F40I2N positions itself as an industrial-grade Stratix V GX FPGA suited for designers who need substantial logic resources, significant embedded memory, and a high count of I/O in a compact FCBGA package. The specified core voltage window and temperature rating support reliable integration into engineered systems where predictable electrical and thermal behavior is required.

This device is appropriate for teams developing networking, telecom, compute-acceleration, or industrial control solutions that require on-chip capacity and board-level integration flexibility, while maintaining regulatory conformity through RoHS compliance.

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