5SGXMA3K2F40C3WN

The 5SGXMA3K2F40C3WN is a Stratix® V GX field-programmable gate array (FPGA) from Intel, designed for high-density digital designs. It integrates 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and up to 600 user I/Os to address systems that require large logic capacity and extensive on-chip storage.

Built in a 1517-BBGA (FCBGA) package and rated for commercial temperature operation, this device is targeted at designers needing high integration and substantial I/O connectivity in a surface-mount FPGA solution.

Key Features

• Core Logic  340,000 logic elements to implement large, complex digital designs and custom logic functions.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, FPGA-based caches, and data-path storage.
• I/O Capacity  600 user I/Os to support wide parallel interfaces, high-pin-count peripherals, and board-level connectivity.
• Power Supply  Core supply range specified at 820 mV to 880 mV to support the device’s required operating conditions.
• Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), designed for surface-mount PCB assembly.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing consistency.
• Documentation  Detailed electrical and switching characteristics for the Stratix V family are provided in the device datasheet for design and validation reference.

Typical Applications

• High-density digital processing  Implement large custom datapaths, accelerators, and signal-processing cores that require extensive logic and on-chip memory.
• Multi-channel I/O systems  Support wide parallel interfaces, multiport data aggregation, and board-level interconnects using the large 600-pin I/O count.
• FPGA-based prototyping and emulation  Use the device’s logic density and memory capacity for prototyping complex ASIC/SoC designs or system emulation.

Unique Advantages

• High logic density: 340,000 logic elements provide capacity for large, consolidated designs and reduces the need for multiple devices.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM lowers external memory requirements and improves data-path latency.
• Extensive I/O integration: 600 I/Os enable complex front-end and back-end interfaces without extensive external bridging logic.
• Compact surface-mount footprint: 1517-BBGA FCBGA package supports high-density board layouts while maintaining a manageable PCB area.
• Commercial-grade operating range: Specified 0 °C to 85 °C operation aligns with standard commercial system environments.
• Regulatory readiness: RoHS compliance supports modern manufacturing and lead-free assembly processes.

Why Choose 5SGXMA3K2F40C3WN?

The 5SGXMA3K2F40C3WN combines substantial logic resources, significant embedded memory, and a high I/O count in a single Stratix V GX FPGA package from Intel. Its specifications make it suitable for designers who need to consolidate complex functions, implement high-throughput datapaths, or prototype large systems while maintaining a compact surface-mount form factor.

With commercial temperature rating and RoHS compliance, this device is positioned for a wide range of commercial electronic designs where integration density, on-chip memory, and I/O capacity drive system architecture decisions. Detailed electrical and switching characteristics are available in the Stratix V device datasheet to support design validation and system integration.

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