5SGXMA3K2F40C3G

The 5SGXMA3K2F40C3G is a Stratix V GX field-programmable gate array (FPGA) in a high-density FCBGA package. Built for designs that require large programmable logic capacity, abundant on-chip memory, and extensive I/O, this device targets advanced digital systems where integration and flexibility are critical.

As a member of the Stratix V family, the device delivers a combination of core logic density, embedded RAM resources, and a broad I/O count that support compute acceleration, complex protocol integration, and system-level prototypes.

Key Features

• Core Logic — Approximately 340,000 logic elements provide large-scale programmable logic capacity for complex algorithms and custom hardware acceleration.
• Logic Array Blocks (LABs) — 128,300 LABs for organized logic routing and placement efficiency across the fabric.
• Embedded Memory — Approximately 19.46 Mbits of on-chip RAM to support large buffers, FIFOs, and data storage for high-throughput designs.
• High I/O Count — 600 general-purpose I/O pins enable broad connectivity for multi-protocol interfacing and dense board-level integration.
• Power Supply — Core supply range of 820 mV to 880 mV to support defined operating conditions for the device.
• Package — 1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40×40) for a compact, high-pin-count footprint.
• Operating Temperature — Commercial grade operation from 0 °C to 85 °C suitable for standard electronics environments.
• Compliance — RoHS-compliant manufacturing status.

Typical Applications

• Compute Acceleration: Use the large logic capacity and embedded RAM for custom hardware acceleration, DSP blocks, and offload engines.
• Protocol Bridging and High-Density I/O: 600 I/O pins support multi-protocol interfacing, board-level multiplexing, and dense peripheral connectivity.
• System Prototyping and Validation: High logic and memory resources enable full-system prototypes, emulation tasks, and rapid hardware development cycles.

Unique Advantages

• High Logic Density: Approximately 340,000 logic elements let you implement complex state machines, pipelines, and custom datapaths without partitioning across multiple devices.
• Substantial Embedded Memory: Nearly 19.46 Mbits of on-chip RAM minimizes external memory dependence for many buffering and streaming applications.
• Extensive I/O Count: 600 I/O pins provide flexibility for multi-lane interfaces, parallel buses, and mixed-signal front-end connections.
• Compact High-Pin Package: The 1517-BBGA (1517-FBGA 40×40) package balances footprint and connective density for space-constrained, high-performance boards.
• Commercial Temperature Grade: Rated from 0 °C to 85 °C for standard commercial deployments and controlled environments.
• RoHS Compliance: Manufactured to RoHS standards for regulatory and environmental alignment.

Why Choose 5SGXMA3K2F40C3G?

The 5SGXMA3K2F40C3G positions itself as a high-density, feature-rich Stratix V GX FPGA suitable for designs that demand significant programmable logic, on-chip memory, and broad I/O. Its combination of logic elements, embedded RAM, and a high pin-count package provides the building blocks required for compute acceleration, protocol conversion, and comprehensive system prototyping.

Engineers and procurement teams looking for a commercially graded Stratix V GX device will find a balance of integration, predictable operating limits, and the capacity to scale complex FPGA-based systems while maintaining board-level connectivity and compact packaging.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the 5SGXMA3K2F40C3G. Our team can provide purchasing details and support to help integrate this device into your next design.