5SGXMA3K2F40C2LN

The 5SGXMA3K2F40C2LN is a commercial-grade Stratix V GX field programmable gate array (FPGA) offering high integration for complex digital designs. It provides 340,000 logic elements, approximately 19.46 Mbits of embedded RAM, and up to 600 general-purpose I/Os in a high-density 1517-BBGA FCBGA package.

Designed for applications that require large logic capacity, significant on-chip memory, and extensive I/O, this device targets advanced communications, compute acceleration, and high-performance embedded systems while operating on a low-voltage core supply.

Key Features

• Logic Capacity  340,000 logic elements for implementing large-scale logic, datapaths, and complex state machines.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM to support buffers, FIFOs, and on-chip data storage.
• I/O Density  Up to 600 I/Os to support broad interfacing requirements and high pin-count system designs.
• Transceiver Capability (Family)  Stratix V GX family devices provide high-speed transceiver support; GX channel rates are documented up to 14.1 Gbps in the device family datasheet (device and speed-grade dependent).
• Power and Voltage  Core voltage supply range of 820 mV to 880 mV to match low-voltage system architectures.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40) with surface-mount mounting.
• Commercial Grade & Temperature  Commercial grade device rated for 0 °C to 85 °C operation.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High-speed networking and telecom equipment  Leverage the family’s GX transceiver capabilities and high logic/memory resources for packet processing, switching, and protocol interfacing.
• Data center acceleration  Implement custom acceleration pipelines, large buffering, and high-connectivity I/O to offload compute-intensive tasks.
• Advanced embedded systems  Use abundant logic elements and on-chip RAM for complex control, signal processing, and real-time data handling.
• Prototyping and system integration  High I/O count and dense logic make this device suitable for validating multi-domain designs and consolidating functions onto a single FPGA.

Unique Advantages

• High logic density: 340,000 logic elements enable consolidation of large designs onto a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 19.46 Mbits of embedded RAM supports deep buffering and local data storage, minimizing external memory dependency.
• Extensive I/O capability: 600 I/Os provide flexibility for multi-interface systems and high pin-count peripherals.
• Low-voltage core operation: Core supply between 820 mV and 880 mV aligns with modern low-power system architectures.
• High-density packaging: 1517-BBGA FCBGA package offers compact board integration while supporting surface-mount assembly.
• Commercial-grade operating range: Rated for 0 °C to 85 °C for deployments in standard commercial environments.

Why Choose 5SGXMA3K2F40C2LN?

The 5SGXMA3K2F40C2LN combines very large logic capacity, substantial embedded memory, and high I/O density in a commercial-grade Stratix V GX FPGA. It is suited to engineers and system designers who need to implement complex algorithms, high-bandwidth interfaces, and consolidated system functions in a single programmable device.

With low-voltage core operation and a compact 1517-BBGA package, this device provides a scalable platform for advanced communications, compute acceleration, and other compute- and I/O-intensive designs while adhering to RoHS requirements.

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