5SGXMA3K2F40C2N

The 5SGXMA3K2F40C2N is a Stratix® V GX FPGA IC from Intel, supplied in a 1517-BBGA (FCBGA) surface-mount package. It delivers a high-capacity programmable logic fabric with a large I/O count and substantial on-chip RAM, intended for designs that require extensive logic density and interface connectivity.

Electrical and switching characteristics for the Stratix V family — including transceiver specifications, core and periphery performance, and I/O timing — are documented in the device datasheet for system-level integration and validation.

Key Features

• High logic capacity — 340,000 logic elements to implement complex, highly parallel logic and control functions.
• Embedded memory — approximately 19.456 Mbits of on-chip RAM for data buffering, state storage, and local memory requirements.
• Extensive I/O — 600 user I/O pins to support dense front-end interfaces and multiple peripheral connections.
• Package and mounting — 1517-BBGA, FCBGA (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for board-level integration.
• Core voltage range — specified supply range of 870 mV to 930 mV for core power delivery.
• Commercial temperature grade — rated for 0 °C to 85 °C operating temperature.
• Environmental compliance — RoHS compliant.
• Documented electrical and timing data — Stratix V device datasheet provides detailed electrical, switching, and I/O timing specifications to support system design and verification.

Typical Applications

• High-density signal processing — Use the large logic element count and embedded RAM to implement complex DSP pipelines and parallel processing engines.
• Large-scale I/O aggregation — 600 I/O pins enable designs that consolidate multiple data streams, sensors, or interface channels on a single device.
• Memory-intensive embedded logic — Approximately 19.456 Mbits of on-chip RAM supports buffering, FIFOs, and state machines without immediate reliance on external memory.
• Board-level system integration — Surface-mount 1517-FBGA package facilitates compact PCB designs where high integration is required.

Unique Advantages

• Significant programmable fabric: 340,000 logic elements provide headroom for large designs and multiple concurrent functions.
• Substantial on-chip RAM: Approximately 19.456 Mbits of embedded memory reduces dependence on external RAM for many buffering and caching needs.
• High I/O density: 600 I/O pins support complex interfacing and multi-channel applications without excessive connectorization.
• Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant for standard commercial deployments.
• System design visibility: Stratix V family documentation includes electrical and timing details to assist integration of transceivers, core, and periphery subsystems.
• Compact BGA package: 1517-FBGA (40×40) surface-mount package enables scalable board implementations with high pin count in a compact footprint.

Why Choose 5SGXMA3K2F40C2N?

The 5SGXMA3K2F40C2N positions itself as a high-capacity Stratix V GX FPGA option for designs that require extensive programmable logic, a large number of I/Os, and significant on-chip memory within a compact BGA package. Its documented electrical and timing characteristics from the Stratix V datasheet provide the technical detail needed for rigorous system integration.

This device is suited for engineering teams building complex, high-density logic systems that benefit from consolidating functions onto a single FPGA while leveraging Intel’s Stratix V family documentation for design validation and development.

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