5SGXMA3K2F40C3N

The 5SGXMA3K2F40C3N is a Stratix® V GX field-programmable gate array (FPGA) from Intel, offered in a 1517-BBGA FCBGA package for surface-mount assembly. This commercial-grade device combines very high logic capacity with substantial on-chip memory and a large I/O count for demanding digital designs.

Key on-chip resources include 340,000 logic elements and approximately 19.46 Mbits of embedded memory, while the device supports up to 600 user I/Os. Operated at a core supply range of 820 mV to 880 mV and rated for 0 °C to 85 °C, it targets complex, high-density applications that require extensive logic, memory and I/O integration.

Key Features

• Core & Logic  340,000 logic elements provide substantial programmable fabric for complex digital functions and wide parallelism.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive algorithms on a single device.
• I/O Density  Up to 600 user I/Os to support broad peripheral integration, high channel counts, and extensive board-level connectivity.
• Power and Core Supply  Core voltage range 820 mV to 880 mV to match system power-rail requirements and core performance settings.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier device package specified as 1517-FBGA (40×40). Surface-mount mounting type suitable for modern PCB assembly.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operating temperature for commercial applications.

Typical Applications

• High-density digital processing  Large logic capacity and embedded memory enable complex signal processing, packet processing, and algorithmic acceleration within a single FPGA.
• Multi-channel I/O systems  High I/O count supports designs with many parallel interfaces, sensor arrays, or multi-lane data paths.
• Systems requiring on-chip RAM  Approximately 19.46 Mbits of embedded memory reduces reliance on external memory for buffering and state storage.

Unique Advantages

• High logic capacity: 340,000 logic elements enable consolidation of complex functions and IP blocks into one device, reducing system BOM and board area.
• Significant on-chip memory: Nearly 19.46 Mbits of RAM supports large buffers and LUT-based designs without immediate need for external memory.
• Extensive I/O resources: 600 user I/Os facilitate dense connectivity and flexible interface mapping for multi-channel systems.
• Robust commercial operating range: Rated for 0 °C to 85 °C to meet typical commercial environment requirements.
• FCBGA package for high-density boards: 1517-BBGA (1517-FBGA 40×40) package supports compact, high-pin-count system designs and surface-mount production.

Why Choose 5SGXMA3K2F40C3N?

The 5SGXMA3K2F40C3N positions itself as a high-capacity Stratix V GX FPGA option for designers needing large programmable logic resources, substantial on-chip RAM, and a high I/O count in a single commercial-grade device. Its combination of 340,000 logic elements, approximately 19.46 Mbits of embedded memory, and 600 I/Os makes it well suited to consolidate complex logic, buffering and interface functions onto a single package.

For teams focused on scalability and integration, this device offers the core resources to develop advanced digital systems while aligning with standard surface-mount production and commercial temperature requirements. The Stratix V GX family datasheet provides detailed electrical and switching characteristics to support design verification and system-level planning.

Request a quote or submit an inquiry for pricing and availability of 5SGXMA3K2F40C3N to move your design forward.