5SGXMA3K2F40I2LN

The 5SGXMA3K2F40I2LN is a Stratix® V GX field programmable gate array (FPGA) from Intel, supplied in a 1517-BBGA (FCBGA) package. It delivers high logic capacity and large on-chip memory with a substantial I/O count, targeting complex digital designs that require dense integration and extended operating range.

This device is offered in an industrial temperature grade with a specified core supply window and surface-mount package, making it suitable for demanding embedded, communications, and signal-processing applications that need robust thermal and electrical operating margins.

Key Features

• Core Capacity  Provides 340,000 logic elements for implementing large, complex digital designs and custom hardware acceleration.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage without external memory dependency.
• I/O Density  600 I/O pins enabling wide parallel interfaces, multi-channel connectivity, and flexible board-level routing options.
• Power Supply  Core voltage specified from 820 mV to 880 mV for the device core power domain.
• Package & Mounting  1517-BBGA (FCBGA) package; Supplier device package listed as 1517-FBGA (40×40). Device is designed for surface-mount assembly.
• Temperature & Grade  Industrial grade with an operating temperature range of –40 °C to 100 °C for extended environmental tolerance.
• Environmental Compliance  RoHS compliant, supporting lead-free and restricted-substance requirements in manufacturing.

Typical Applications

• High-performance communications  Large logic and memory capacity combined with high I/O count allow implementation of protocol processing, packet handling, and multi-port interfacing.
• Signal processing and acceleration  On-chip RAM and extensive logic resources enable buffering, filtering, and real-time data-path implementations for DSP and FPGA-accelerated workloads.
• Industrial control and automation  Industrial temperature rating and high I/O density make the device suitable for motor control, machine vision front-ends, and distributed control systems.
• Test and measurement systems  High logic density and I/O flexibility support custom measurement front-ends, trigger logic, and real-time data aggregation.

Unique Advantages

• High logic density: 340,000 logic elements accommodate complex state machines, deep pipelines, and extensive DSP logic without partitioning across multiple devices.
• Substantial embedded memory: Approximately 19.456 Mbits of on-chip RAM reduces dependence on external memory for buffering and accelerates data-path performance.
• Extensive I/O: 600 available I/Os enable multi-channel interfacing and high-bandwidth parallel connections to peripherals and daughter cards.
• Industrial robustness: Specified –40 °C to 100 °C operating range suits deployments in extended-temperature environments.
• Space-efficient package: 1517-BBGA (FCBGA) package in a 1517-FBGA (40×40) supplier outline supports high-density board designs and surface-mount assembly.
• RoHS compliance: Facilitates integration into lead-free manufacturing processes and regulatory-compliant products.

Why Choose 5SGXMA3K2F40I2LN?

The 5SGXMA3K2F40I2LN positions itself for designs that demand a combination of large logic capacity, significant embedded memory, and wide I/O connectivity within an industrial temperature envelope. Its 1517-BBGA surface-mount package and specified core voltage range make it appropriate for tightly integrated boards where power and space are constrained.

Choose this Stratix® V GX device when your project requires scalable logic resources, on-chip RAM to minimize external components, and robust operation from –40 °C to 100 °C—backed by Intel's Stratix V device family pedigree.

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