5SGXMA3K2F40I2LG

The 5SGXMA3K2F40I2LG is a Stratix V GX family FPGA from Intel, supplied in a 1517-BBGA (FCBGA) surface-mount package. It delivers very high logic capacity and large on-chip memory while providing up to 600 I/O pins and an industrial operating temperature range.

Designed for high-density programmable logic applications, this device combines approximately 340,000 logic elements with approximately 19.456 Mbits of embedded memory and a low-voltage core supply (0.82–0.88 V) to support complex, power-aware system designs.

Key Features

• Core & Logic  Approximately 340,000 logic elements to implement complex digital systems and large-scale custom logic.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, lookup tables, and local data storage.
• I/O Capacity  Up to 600 I/O pins to enable broad system connectivity and integration with external peripherals and interfaces.
• Power  Core voltage supply range of 0.820 V to 0.880 V for low-voltage operation and power-optimized designs.
• Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), surface-mount mounting for compact board implementation.
• Thermal & Grade  Industrial grade device with an operating temperature range of –40 °C to 100 °C for deployment in demanding environments.
• Standards Compliance  RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

• High-density programmable logic systems  Implements complex custom logic and control functions that require large logic element counts and embedded memory.
• System integration and I/O consolidation  Uses the 600 I/O pins to aggregate multiple interfaces and reduce external glue logic.
• Industrial and rugged deployments  Industrial temperature rating supports use in equipment expected to operate between –40 °C and 100 °C.

Unique Advantages

• High logic capacity: Approximately 340,000 logic elements enable implementation of complex designs on a single FPGA.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for many buffering and local storage needs.
• Extensive I/O: Up to 600 I/O pins simplify system-level integration and reduce the need for additional interface components.
• Industrial-grade operation: Rated for –40 °C to 100 °C, allowing deployment in temperature-challenging environments.
• Low-voltage core: 0.820–0.880 V supply supports lower power core operation and aligns with power-sensitive designs.
• Compact surface-mount package: 1517-BBGA (FCBGA) package provides a high-density, board-level solution for space-constrained designs.

Why Choose 5SGXMA3K2F40I2LG?

The 5SGXMA3K2F40I2LG combines high logic density, significant embedded memory, and broad I/O capability in an industrial-grade Stratix V GX FPGA package. Its low-voltage core and surface-mount 1517-BBGA footprint make it suitable for designs that require both integration density and power-aware operation.

This device is well suited for teams and projects that need scalable programmable logic resources, robust thermal performance, and a compact, manufacturable package backed by Intel’s Stratix V family documentation and electrical specifications.

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