5SGXMA3K2F40I2G

The 5SGXMA3K2F40I2G is a Stratix V GX FPGA IC from Intel, offered in an industrial temperature grade. It provides a high-density programmable fabric suitable for complex logic, large on-chip memory requirements, and designs demanding extensive I/O.

Key architectural characteristics include approximately 340,000 logic elements, roughly 19.46 Mbits of embedded RAM, and up to 600 I/Os. The device is supplied in a 1517-ball FCBGA package and operates over a core voltage range of 870 mV to 930 mV and a temperature range of −40 °C to 100 °C.

Key Features

• Core and Logic Approximately 340,000 logic elements for implementing large-scale, custom digital logic and control functions.
• Embedded Memory Approximately 19.46 Mbits of on-chip RAM to support buffering, packet processing, and deep pipeline storage.
• I/O Density Up to 600 dedicated I/O pins to support wide parallel interfaces, high-channel-count sensor arrays, and multi-lane connectivity.
• Power and Supply Core voltage supply range of 870 mV to 930 mV for device core operation.
• Package and Mounting 1517‑BBGA (FCBGA) package, supplier device package listed as 1517‑FBGA (40×40), with surface-mount mounting type.
• Temperature and Grade Industrial temperature grade with an operating range from −40 °C to 100 °C for use in temperature-demanding environments.
• Regulatory RoHS compliant.

Typical Applications

• Industrial Control and Automation Programmable logic and high I/O count enable motor control, real-time signal processing, and factory automation interfaces within industrial temperature ranges.
• Data Processing and Acceleration Large logic capacity and significant on-chip RAM support custom accelerators, packet processing, and data-path implementations.
• High-Density I/O Systems Up to 600 I/Os allow aggregation of multiple sensors, parallel busses, or multi-channel data acquisition systems.
• High-Speed Serial and Transceiver-Based Designs As a Stratix V GX family device, it is aligned with series-level GX transceiver capabilities documented for the family, enabling integration into high-throughput serial systems.

Unique Advantages

• High Logic Capacity: Approximately 340,000 logic elements let you implement complex, large-scale finite state machines, DSP chains, and control logic without external ASICs.
• Substantial Embedded Memory: Approximately 19.46 Mbits of on-chip RAM reduces dependence on external memory for buffering and accelerates data-path operations.
• Extensive I/O Count: Up to 600 I/Os simplify board-level routing for multi-channel systems and reduce the need for external I/O expanders.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in temperature-challenging industrial environments.
• Compact FCBGA Package: 1517‑BBGA (1517‑FBGA 40×40) surface-mount package balances high pin count with a compact footprint for dense board designs.
• RoHS Compliant: Conforms to RoHS requirements for environmental and manufacturing considerations.

Why Choose 5SGXMA3K2F40I2G?

The 5SGXMA3K2F40I2G positions itself as a high-density, industrial-grade Stratix V GX FPGA option for designs that require a large number of logic elements, significant on-chip memory, and wide I/O capability. Its FCBGA package and surface-mount mounting make it suitable for compact, production-grade PCBs where reliability across a broad temperature range is important.

Engineers designing industrial control systems, data-path accelerators, or multi-channel interfacing hardware will find a clear match between the device’s listed specifications and system requirements. The device’s family-level transceiver characteristics and comprehensive on-chip resources support scalable designs and long-term deployment needs.

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