5SGXMA3K2F40I3LG

The 5SGXMA3K2F40I3LG is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, designed for high-density, industrial-grade programmable logic applications. This device combines 340,000 logic elements, approximately 19.5 Mbits of embedded memory, and up to 600 user I/Os in a 1517-BBGA FCBGA package for complex system-level integration.

With an industrial operating temperature range and a low-voltage core supply window, this Stratix V GX device targets demanding designs that require significant on-chip resources, high I/O capacity, and surface-mount packaging for board-level assembly.

Key Features

• Core & Logic  340,000 logic elements provide large programmable logic capacity for complex custom hardware implementations and accelerated datapaths.
• Embedded Memory  Approximately 19.5 Mbits of on-chip RAM to support large buffers, FIFOs, and on-chip data storage for high-throughput designs.
• I/O Density  Up to 600 general-purpose I/Os to support broad connectivity and parallel interfacing across multiple subsystems.
• Power and Voltage  Core supply operating range from 820 mV to 880 mV to match system power-rail designs and enable predictable core behavior.
• Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), designed for surface-mount assembly on modern PCBs.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Regulatory  RoHS compliant for environmental and manufacturing conformity.

Typical Applications

• High-density compute and acceleration  Large logic element count and substantial on-chip RAM enable custom accelerators and compute-intensive implementations.
• Networking and communications  High I/O count and Stratix V GX family capabilities make the device suitable for complex packet processing, protocol bridging, and board-level interface consolidation.
• Industrial control and automation  Industrial temperature rating and robust packaging support deployment in factory and process-control equipment that require extended operating ranges.
• Prototype and system integration  Surface-mount 1517-FBGA packaging and large resource set help designers validate and integrate system functions prior to production.

Unique Advantages

• High integration density: 340,000 logic elements reduce board-level component count by consolidating logic into a single FPGA.
• Significant on-chip memory: Approximately 19.5 Mbits of embedded RAM supports large buffers and local data storage, reducing external memory bandwidth needs.
• Broad I/O capability: 600 I/Os allow flexible interfacing to multiple peripherals, sensors, and high-pin-count connectors.
• Industrial temperature rating: −40 °C to 100 °C operation addresses demanding environmental requirements for industrial applications.
• Low-voltage core operation: 820 mV–880 mV supply window enables predictable core power design and integration with low-voltage power systems.
• RoHS compliant and surface-mount package: Supports modern manufacturing and environmental standards with a 1517-BBGA FCBGA footprint.

Why Choose 5SGXMA3K2F40I3LG?

The 5SGXMA3K2F40I3LG provides a high-capacity Stratix V GX FPGA solution that balances extensive programmable logic, sizable on-chip memory, and a high I/O count in a surface-mount 1517-BBGA package. Its industrial temperature rating and RoHS compliance make it suitable for applications that require robust operation across temperature extremes and modern manufacturing practices.

This device is appropriate for design teams building compute accelerators, complex networking boards, or industrial control systems that need a scalable, high-resource FPGA platform backed by Intel’s Stratix V family documentation.

Request a quote or submit a procurement inquiry to evaluate the 5SGXMA3K2F40I3LG for your next design.