5SGXMA3K2F40I3LN

The 5SGXMA3K2F40I3LN is an Intel Stratix V GX family FPGA offered in an industrial temperature grade and a 1517-ball FCBGA package. It provides a high-density, transceiver-capable FPGA fabric in a surface-mount BGA package, delivering a combination of large logic capacity, significant on‑chip memory, and extensive I/O for complex system designs.

Designed for applications that require dense logic integration, abundant embedded RAM and a high I/O count, this device targets transceiver-enabled and high-performance embedded systems where industrial temperature operation and RoHS compliance are required.

Key Features

• Logic Capacity  Approximately 340,000 logic elements to implement large combinational and sequential designs.
• Embedded Memory  Approximately 19.46 Mbits of on‑chip RAM for buffering, packet processing, and intermediate storage.
• I/O Count  600 user I/O pins to support wide parallel interfaces and multiple high‑pin-count peripherals.
• Power and Core Voltage  Core voltage supply range specified at 820 mV to 880 mV for the FPGA core power rails.
• Package and Mounting  1517-BBGA (FCBGA) / supplier package 1517-FBGA (40×40); surface-mount configuration for compact board-level integration.
• Temperature and Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-stressed environments.
• Standards Compliance  RoHS compliant, supporting regulatory requirements for hazardous-substance reduction.

Typical Applications

• High-speed communications  Large logic density and transceiver-capable Stratix V GX architecture support packet processing and interface aggregation in networking equipment.
• Data center and compute acceleration  Substantial logic elements and on‑chip RAM enable custom accelerators and data-path processing for compute-intensive tasks.
• Industrial control and automation  Industrial temperature rating and high I/O count make the device suitable for complex control, sensor aggregation, and real‑time processing in industrial systems.
• Signal processing  Dense logic and embedded memory provide resources for streaming DSP, filtering, and protocol handling in communication and instrumentation equipment.

Unique Advantages

• High logic density: With approximately 340,000 logic elements, complex HDL designs and large finite-state machines can be implemented without partitioning across multiple devices.
• Ample on-chip memory: Approximately 19.46 Mbits of embedded RAM reduces external memory dependence for buffering and local storage.
• Extensive I/O capability: 600 I/O pins enable broad system connectivity and parallel interface support, simplifying board-level integration.
• Industrial-grade operation: Specified for −40 °C to 100 °C operation to meet environmental demands in industrial deployments.
• Compact BGA packaging: 1517-ball FCBGA (40×40) package balances high pin count with a compact footprint for dense PCB layouts.
• Low-voltage core support: Core supply range of 0.82–0.88 V supports modern low-voltage FPGA core operation.

Why Choose 5SGXMA3K2F40I3LN?

The 5SGXMA3K2F40I3LN positions itself as a high-density, industrial-grade Stratix V GX FPGA that brings together large logic capacity, substantial embedded RAM, and a high number of I/Os in a compact FCBGA package. Its electrical characteristics and device family documentation address transceiver performance, I/O timing and core operating conditions, making it suitable for demanding, high-performance applications where robust operation across a wide temperature range is required.

Engineers designing network, compute-acceleration, signal-processing, or industrial control systems will find the combination of logic resources, embedded memory and I/O count useful for consolidating functions onto a single programmable device while maintaining design flexibility and scalability within the Stratix V device family.

Request a quote or submit an inquiry to obtain pricing and availability for 5SGXMA3K2F40I3LN and to discuss how this FPGA can meet your design requirements.