5SGXMA3K2F40C2LG

The 5SGXMA3K2F40C2LG is a Stratix V GX family FPGA from Intel, presented in a 1517-BBGA (FCBGA) package. It delivers very large logic capacity, substantial on-chip memory, and a high I/O count in a commercial-temperature, surface-mount device.

This device targets designs that require high integration density and flexible I/O — offering 340,000 logic elements, approximately 19.456 Mbits of embedded RAM, and 600 user I/O pins, while supporting the Stratix V GX transceiver capabilities outlined in the device family documentation.

Key Features

• Core Architecture  Strives within the Stratix V GX device family architecture — designed for high-density, high-performance FPGA implementations as documented in the Stratix V device datasheet.
• Logic Capacity  340,000 logic elements to implement large digital designs and complex programmable logic functions.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, packet storage, and state tables.
• High I/O Count  600 user I/O pins to support wide parallel interfaces and dense board-level integration.
• Transceiver Support (Family)  Stratix V GX family documentation lists GX transceiver speed grades, including support for high-speed channels (see device datasheet for speed-grade details).
• Power Supply  Core voltage supply range of 820 mV to 880 mV for defined operating conditions.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier device package 1517-FBGA (40×40); surface-mount mounting type.
• Operating Conditions  Commercial temperature grade with an operating range from 0 °C to 85 °C.
• Compliance  RoHS compliant.

Unique Advantages

• High logic density: 340,000 logic elements enable consolidation of large functions onto a single device, reducing board-level complexity.
• Substantial on-chip RAM: Approximately 19.456 Mbits of embedded memory supports buffering and data-path requirements without immediate external memory.
• Extensive I/O: 600 I/O pins provide flexibility for parallel interfaces, multi-lane connectivity, and dense system integration.
• Commercial-grade availability: Rated for 0 °C to 85 °C operation for mainstream commercial applications.
• Surface-mount BBGA package: 1517-BBGA (40×40) package supports compact PCB layouts and high-density board designs.

Why Choose 5SGXMA3K2F40C2LG?

The 5SGXMA3K2F40C2LG positions itself for designs demanding large programmable logic resources, significant embedded memory, and broad I/O capability within a commercial-temperature, surface-mount form factor. Its alignment with the Stratix V GX device family and published electrical and switching characteristics make it suitable where documented transceiver performance and detailed device specifications are required.

Choose this device when you need high integration density, comprehensive on-chip RAM, and extensive I/O in a RoHS-compliant FPGA backed by Intel's Stratix V documentation and support resources.

Request a quote or submit an inquiry to receive pricing and availability details for the 5SGXMA3K2F40C2LG. Our team can provide ordering information and help evaluate this Stratix V GX device for your design needs.