5SGXMA3K2F40C1G

The 5SGXMA3K2F40C1G is a Stratix V GX family FPGA device offering a high-density programmable logic resource with 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and 600 programmable I/Os. This commercial-grade, surface-mount FCBGA device is specified for core supply voltages from 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C.

As a member of the Stratix V GX series, the device is documented within the Stratix V device datasheet for electrical and switching characteristics, enabling designers to evaluate core, I/O, and transceiver operating conditions where applicable.

Key Features

• Core Logic 
  340,000 logic elements for implementing large-scale programmable logic and complex digital functions.
• Embedded Memory 
  Approximately 19.456 Mbits of on-chip RAM for buffering, state storage, and data-path acceleration.
• I/O Density 
  600 I/O pins to support wide parallel interfaces and multiple high-pin-count peripherals.
• Power and Supply 
  Core supply voltage specified from 870 mV to 930 mV to match platform power delivery requirements.
• Package and Mounting 
  1517-BBGA FCBGA package; supplier device package listed as 1517-FBGA (40×40). Surface-mount device suitable for standard PCB assembly.
• Temperature and Grade 
  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance 
  RoHS compliant.

Typical Applications

• High-density digital systems 
  Deploy where a large number of logic elements and on-chip memory are required to implement complex algorithms and datapaths.
• Multi‑I/O interface hubs 
  Use the 600 I/Os to aggregate and bridge numerous parallel and serial interfaces within a single FPGA package.
• Prototyping and system validation 
  Leverage the device’s capacity and documented electrical characteristics for board‑level prototyping and design verification of advanced digital designs.

Unique Advantages

• High logic capacity: 340,000 logic elements enable integration of substantial hardware functionality into a single device, reducing external component count.
• Significant on‑chip RAM: Approximately 19.456 Mbits of embedded memory supports large buffers and local data storage to accelerate data‑intensive tasks.
• Extensive I/O count: 600 I/Os facilitate broad connectivity for high‑pin‑count systems and dense board-level interfaces.
• Compact, serviceable package: 1517-BBGA/1517-FBGA (40×40) FCBGA packaging provides a high pin density in a surface-mount form factor suitable for modern PCB layouts.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation for standard commercial applications.
• Regulatory compliance: RoHS compliant to meet common environmental and manufacturing requirements.

Why Choose 5SGXMA3K2F40C1G?

The 5SGXMA3K2F40C1G offers a balanced combination of large logic capacity, substantial embedded memory, and high I/O density within the Stratix V GX family. Its electrical and package specifications make it suitable for designs that consolidate complex digital functions and multiple interfaces into a single, surface-mount FPGA.

Choose this device for projects that require documented device characteristics, significant on-chip resources, and a commercial-grade temperature envelope, enabling scalable design implementations within the Stratix V device family.

Request a quote or submit a purchasing inquiry through your preferred distributor or procurement channel to evaluate availability and pricing for the 5SGXMA3K2F40C1G.