5SGXMA3K2F35I3WN

The 5SGXMA3K2F35I3WN is a Stratix V GX family FPGA from Intel, delivered in a 1152-BBGA FCBGA package. It combines a high logic capacity and substantial on-chip memory with a large I/O complement for demanding industrial and high-performance embedded designs.

Designed for systems that require extensive programmable logic, on-chip RAM resources, and broad I/O connectivity, this device targets applications in communications, signal processing, and other compute-intensive markets where board-level integration and industrial temperature operation are required.

Key Features

• Core Logic  Approximately 340,000 logic elements and 128,300 logic blocks provide the programmable capacity for complex RTL implementations and large custom datapaths.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffers, FIFOs, and on-chip storage for high-throughput designs.
• I/O Resources  600 user I/O pins to support wide parallel interfaces, large buses, and multi-channel connectivity.
• Package & Mounting  1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface-mount package supports compact board-level integration.
• Power Supply  Core supply operating range specified at 820 mV to 880 mV for the device core domain.
• Temperature Grade  Industrial grade operation with an ambient operating range of −40 °C to 100 °C for deployment in industrial environments.
• Regulatory / Environmental  RoHS compliant.

Typical Applications

• High-speed communications  Large logic capacity and abundant I/O enable implementations of protocol offload, packet processing, and interface bridging for network equipment.
• Digital signal processing  Substantial on-chip RAM and wide logic resources support real-time DSP chains, filtering, and custom accelerator functions.
• Data acquisition and instrumentation  High I/O count and programmable logic density make the device suitable for multi-channel ADC/DAC front ends and custom measurement processing.
• Prototyping and emulation  The device’s large logic and memory resources support complex SoC prototyping and hardware-software co-design environments.

Unique Advantages

• High programmable capacity: The combination of ~340,000 logic elements and 128,300 logic blocks enables large-scale logic integration without partitioning across multiple devices.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces external memory dependence and improves throughput for streaming and buffering uses.
• Broad I/O connectivity: 600 I/O pins support complex interface mixes and high channel counts, simplifying system partitioning.
• Industrial temperature operation: Specified −40 °C to 100 °C operation suits deployments in industrial environments where extended temperature ranges are required.
• Compact FCBGA package: The 1152-ball FCBGA (35×35) package delivers high pin density in a compact footprint for space-constrained PCBs.
• RoHS compliant: Meets environmental compliance requirements for lead-free assembly and global manufacturing.

Why Choose 5SGXMA3K2F35I3WN?

The 5SGXMA3K2F35I3WN delivers a balance of high logic density, substantial embedded memory, and extensive I/O in an industrial-grade Stratix V GX device. It is positioned for engineers building high-throughput, compute- and I/O-intensive systems that require a compact, surface-mount FPGA solution backed by Intel’s Stratix V family documentation and support.

This device is suitable for designs that need scalability of logic and memory resources on a single device, enabling reduced BOM complexity and streamlined board layouts while maintaining operation across industrial temperature ranges.

Request a quote or submit an inquiry to start evaluating the 5SGXMA3K2F35I3WN for your next design. Technical documentation for the Stratix V family, including electrical and switching characteristics, is available from the manufacturer to support system integration and validation.