5SGXMA3K2F35I3G

The 5SGXMA3K2F35I3G is an Intel Stratix® V GX family FPGA in a 1152-BBGA (35×35) FCBGA package. It delivers very large logic capacity and extensive I/O in a surface-mount, industrial-grade device designed for applications that require high integration and on-chip memory.

This device is characterized by 340,000 logic elements, approximately 19.456 Mbits of embedded RAM, up to 600 I/O, and an operating temperature range of −40 °C to 100 °C. The device uses a core supply range of 0.820 V to 0.880 V and conforms to RoHS requirements.

Key Features

• Core Logic  340,000 logic elements provide extensive programmable fabric for complex digital designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, lookup tables, and state storage.
• I/O Density  Up to 600 I/O pins enable high connector and interface density for multi-channel systems.
• Package and Mounting  1152-BBGA (FCBGA) supplier package, 35×35, optimized for surface-mount assembly and high pin count routing.
• Power  Core voltage supply specified between 0.820 V and 0.880 V for the programmable fabric.
• Temperature and Grade  Industrial temperature grade with an operating range of −40 °C to 100 °C for deployment in challenging environments.
• Standards Compliance  RoHS compliant to support regulatory and environmental requirements.
• Stratix V GX Family Characteristics  Part of the Stratix V device family; refer to the Stratix V device datasheet for device-level electrical and transceiver characteristics.

Typical Applications

• Industrial Control and Automation  Industrial temperature grade and broad I/O support make this device suitable for control systems and instrumentation requiring robust operation.
• High-Speed Communications  Stratix V GX family devices include GX transceiver options in the device datasheet; the device’s high I/O count supports multi-channel communications interfaces.
• Compute Acceleration and Data Processing  Large logic capacity and substantial embedded RAM support custom accelerators, packet processing, or protocol offload implementations.

Unique Advantages

• Massive Logic Capacity: 340,000 logic elements enable implementation of large, complex FPGA designs without immediate need to partition across multiple devices.
• Significant On-Chip Memory: Approximately 19.456 Mbits of embedded RAM reduces external memory dependence for many buffering and stateful functions.
• High I/O Count: Up to 600 I/O pins allow dense peripheral and protocol connectivity in a single package.
• Industrial Temperature Rating: −40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
• Compact, High-Density Package: 1152-BBGA (35×35) FCBGA package delivers high pin count in a compact surface-mount form factor.
• Controlled Core Supply Range: Core voltage specified between 0.820 V and 0.880 V for predictable power design and rail planning.

Why Choose 5SGXMA3K2F35I3G?

The 5SGXMA3K2F35I3G combines substantial programmable logic, sizeable embedded RAM, and a very high I/O count in an industrial-grade Stratix V GX device package. Its specification set supports complex system designs that require on-chip resources, dense connectivity, and operation across wide temperature ranges.

This device is well suited to engineering teams building high-density, performance-oriented FPGA solutions that require a robust hardware foundation and clear electrical parameters for power and thermal planning.

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