5SGXMA3K2F35I2N

The 5SGXMA3K2F35I2N is a Stratix V GX family FPGA offering a high-density programmable logic fabric and on-chip memory. This industrial-grade device provides a large logic capacity together with extensive I/O to address complex, high-performance designs.

As a Stratix V GX device, it is part of a series that supports multiple transceiver speed grades for high-speed interfaces while delivering the core resources and environmental range required for demanding embedded and industrial applications.

Key Features

• Logic Capacity — 340,000 logic elements for implementing large-scale digital designs and complex algorithms.
• Configurable Fabric — Approximately 128,300 LABs/CLBs equivalent fabric resources to structure designs across many logic blocks.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM to support buffering, packet storage, and state machines without external memory.
• I/O Resources — Up to 600 I/O pins to connect a wide range of peripherals, buses, and high-pin-count interfaces.
• Transceiver Support (Series) — Stratix V GX devices are offered in multiple transceiver speed grades, providing options for high-speed serial interfaces at the series level.
• Power and Supply — Core voltage supply range of 870 mV to 930 mV for precise core power delivery.
• Package and Mounting — 1152-BBGA / FCBGA package; supplier device package listed as 1152-FBGA (35×35); surface-mount mounting for modern PCB assembly.
• Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C for industrial-environment deployments.
• Compliance — RoHS compliant.

Typical Applications

• High-density signal processing — Large logic element count and substantial embedded RAM enable implementation of wide datapaths, filters, and parallel processing engines.
• High-pin-count interface aggregation — Up to 600 I/O makes the device suitable for designs that require many peripheral or bus connections.
• Industrial and embedded control systems — Industrial temperature rating and surface-mount packaging support deployment in robust embedded and industrial hardware.

Unique Advantages

• High programmable capacity: 340,000 logic elements provide the headroom to implement complex functions on-chip, reducing dependence on external processors or discrete logic.
• Substantial embedded RAM: Approximately 19.456 Mbits of on-chip memory simplifies buffer and state storage needs, lowering BOM and board-level memory requirements.
• Large I/O count: 600 I/O pins enable dense connectivity to sensors, transceivers, and subsystem interfaces without multiplexing compromises.
• Industrial temperature support: –40 °C to 100 °C operation ensures suitability for harsh environments where thermal range is critical.
• Compact package, surface-mount ready: 1152-FBGA (35×35) package supports high-density PCB layouts and modern assembly flows.
• Standards-aligned manufacturing: RoHS compliance supports regulated supply-chain and manufacturing requirements.

Why Choose 5SGXMA3K2F35I2N?

The 5SGXMA3K2F35I2N combines a high logic element count, significant embedded memory, and a large I/O complement in an industrial-grade Stratix V GX device. It is well suited for teams building complex, high-density FPGA solutions that require substantial on-chip resources and broad interfacing capability.

For engineers and procurement focused on scalable, robust FPGA implementations, this device delivers the core building blocks—logic, memory, I/O, and industrial temperature range—necessary to support long-term, high-performance designs within the Stratix V GX family.

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