5SGXMA3K2F35I2LG

The 5SGXMA3K2F35I2LG is a Stratix® V GX field-programmable gate array (FPGA) IC from Intel, delivered in a 1152-ball FCBGA package. It provides a high-density programmable logic fabric with substantial embedded memory and a large I/O count, offered in an industrial temperature grade.

Designed for designs that require extensive on-chip logic, memory resources, and high I/O connectivity, the device supports the Stratix V family’s electrical and transceiver characteristics as documented for GX devices.

Key Features

• High Logic Capacity — 340,000 logic elements to implement complex custom logic and wide parallel datapaths.
• Embedded Memory — Approximately 19.46 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive functions.
• Large I/O Count — 600 I/O pins to support dense external interfacing and multi-channel connectivity.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet industrial-environment requirements.
• Package and Mounting — 1152-ball FBGA (35×35) FCBGA package, surface-mount for modern PCB assembly flows.
• Core Voltage — Operates with a supply range of 820 mV to 880 mV as specified for the device.
• Standards Compliance — RoHS compliant to support regulatory requirements for lead-free assemblies.
• Stratix V GX Family Characteristics — Includes the series' documented electrical and transceiver capabilities for high-speed serial links (series-level specifications shown in the Stratix V device datasheet).

Typical Applications

• High‑speed communications — Implement multi‑lane serial interfaces and protocol processing where the Stratix V GX series transceiver characteristics are required.
• Industrial control systems — Use the device’s industrial temperature rating, large I/O count, and programmable logic to implement deterministic control, signal aggregation, and interface logic.
• Data buffering and preprocessing — Leverage the approximately 19.46 Mbits of embedded RAM and large logic capacity to perform on‑chip data staging, packet processing, or preprocessing tasks.

Unique Advantages

• Substantial on‑chip resources: 340,000 logic elements and approximately 19.46 Mbits of embedded RAM reduce reliance on external components and simplify system architectures.
• High connectivity: 600 I/Os enable dense sensor, peripheral, or multi‑lane interface integration without extensive external multiplexing.
• Industrial robustness: −40 °C to 100 °C operating range and surface-mount FCBGA packaging support deployment in industrial environments.
• Controlled core power envelope: Specified supply range of 820 mV–880 mV provides clear power design targets for regulators and power sequencing.
• Regulatory preparedness: RoHS compliance supports lead‑free assembly requirements.

Why Choose 5SGXMA3K2F35I2LG?

The 5SGXMA3K2F35I2LG brings together a high logic capacity, significant embedded memory, and a large I/O complement in an industrial-grade Stratix V GX device package. It is well suited to designs that require on‑chip processing, extensive interfacing, and adherence to industrial temperature limits.

With Intel’s Stratix V family electrical and transceiver characteristics documented in the device datasheet, this part offers a scalable platform for engineers needing substantial programmable resources while maintaining clear power, package, and environmental specifications.

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