5SGXMA3K2F35C3G

The 5SGXMA3K2F35C3G is a commercial-grade Stratix V GX FPGA from Intel, delivering a high-capacity programmable logic fabric targeted at complex digital designs. With approximately 340,000 logic elements and about 19.5 Mbits of embedded memory, this device is built for applications requiring dense logic, substantial on-chip RAM, and a large number of I/Os.

Packaged in a 1152-ball FCBGA (35 × 35 mm) surface-mount package and specified for a core voltage range of 0.820–0.880 V and an operating temperature range of 0 °C to 85 °C, the part is suited to commercial systems where integration density and I/O count are primary design drivers.

Key Features

• Logic Capacity  Approximately 340,000 logic elements for implementing large-scale digital systems and complex datapaths.
• Embedded Memory  Approximately 19.5 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• High I/O Count  600 user I/Os to enable rich connectivity options for peripherals, high-pin-count interfaces, and parallel data buses.
• Core Voltage  Specified core supply range of 0.820 V to 0.880 V for the device core.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, matching typical commercial electronics environments.
• Package and Mounting  1152-ball BGA (FCBGA) in a 35 × 35 mm footprint with surface-mount mounting for dense board designs.
• Regulatory Compliance  RoHS-compliant construction for compatibility with common environmental and manufacturing requirements.

Typical Applications

• Network Infrastructure  Implement packet processing, protocol offload, and custom switching logic using the device’s large logic and I/O resources.
• Data Acceleration  Use the substantial logic and embedded RAM to build hardware accelerators and custom compute pipelines for data-center appliances.
• Signal Processing  Deploy DSP chains and high-throughput data paths that benefit from dense logic and local memory for buffering and real-time processing.
• Video and Broadcast Systems  Integrate multi-channel video processing and bridging functions that require many I/Os and significant on-chip storage.

Unique Advantages

• High Integration Density: Approximately 340,000 logic elements and 19.5 Mbits of embedded RAM minimize reliance on external components for logic and temporary storage.
• Extensive I/O Resources: 600 user I/Os support complex board-level connectivity and parallel interfaces without extensive multiplexing.
• Commercial-Grade Specification: Designed and specified for 0 °C to 85 °C operation to meet standard commercial system requirements.
• Compact BGA Package: 1152-ball FCBGA (35 × 35 mm) offers a high pin count in a compact footprint for space-constrained, high-density PCBs.
• Controlled Core Supply Range: 0.820–0.880 V core voltage specification supports predictable power-domain planning in multi-voltage designs.
• RoHS Compliance: Environmentally compliant construction eases integration into RoHS-aware manufacturing workflows.

Why Choose 5SGXMA3K2F35C3G?

The 5SGXMA3K2F35C3G positions itself as a high-capacity Stratix V GX device suitable for commercial designs that demand large programmable logic arrays, substantial on-chip memory, and abundant I/O. Its combination of approximately 340,000 logic elements, about 19.5 Mbits of embedded RAM, and 600 I/Os makes it a practical choice for network, signal processing, data acceleration, and video applications where board-level integration density matters.

Designed and specified with clear electrical and thermal limits, and delivered in a 1152-ball FCBGA package, this FPGA supports scalable implementations and predictable system design choices for engineering teams and procurement looking for high-density programmable logic in commercial environments.

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