5SGXMA3K2F35C2LN

The 5SGXMA3K2F35C2LN is a Stratix V GX family field-programmable gate array (FPGA) optimized for high-density, high-I/O system designs. It delivers 340,000 logic elements and approximately 19.456 Mbits of on-chip RAM, making it suitable for complex programmable logic, large buffering, and data-path implementations.

Designed as a commercial-grade device with surface-mount 1152-FBGA packaging (35 × 35 mm), this Stratix V GX device targets applications that require extensive I/O connectivity and substantial embedded memory while operating within a low core-voltage range of 820 mV to 880 mV.

Key Features

• Core Capacity  340,000 logic elements (LEs) for implementing large programmable logic designs and complex finite-state machines.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support deep buffering, lookup tables, and packet/frame storage without external memory.
• I/O Density  600 I/O pins to support wide parallel buses, multiple interfaces, and high pin-count system integration.
• Power  Low-voltage core operation with a supply range of 820 mV to 880 mV, enabling designs that require reduced core voltage domains.
• Package & Mounting  1152-ball FBGA package (1152-FBGA, 35 × 35 mm); surface-mount mounting type suitable for automated PCB assembly.
• Operating Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS-compliant, supporting regulatory and assembly compliance requirements.
• Documentation  Device is part of the Stratix V family; electrical characteristics and operating conditions are documented in the Stratix V device datasheet.

Typical Applications

• High-performance data processing  Implement large custom datapaths, packet processing, and accelerated algorithms using the device's logic density and embedded RAM.
• Telecommunications and networking  Leverage abundant I/O and on-chip memory for wide bus interfaces, buffering, and protocol bridging in network line cards or switching equipment.
• Video and imaging pipelines  Use the large logic and memory resources to build multi-channel video processing, frame buffering, and real-time image pipelines.
• Prototyping and system integration  High I/O count and dense logic enable integration of multiple subsystems and rapid prototyping of complex SoC functions.

Unique Advantages

• High integration density: 340,000 logic elements reduce the need for companion FPGAs or external glue logic, simplifying board-level design.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM supports large buffers and state storage without adding external memory components.
• Extensive I/O capability: 600 I/Os accommodate multiple parallel interfaces, wide buses, and high-pin-count peripherals directly.
• Low core-voltage operation: 820 mV to 880 mV supply range allows integration into low-voltage system domains.
• Compact, production-ready package: 1152-FBGA (35 × 35 mm) surface-mount package balances board-area efficiency and assembly compatibility.
• RoHS compliance: Contributes to regulatory and manufacturing readiness for mainstream commercial products.

Why Choose 5SGXMA3K2F35C2LN?

The 5SGXMA3K2F35C2LN delivers a compelling combination of logic capacity, embedded memory, and I/O density in a single commercial-grade Stratix V GX device. Its specifications suit designers who need substantial on-chip resources for data-intensive applications while keeping board-level complexity and component counts low.

This part is appropriate for design teams building high-throughput processing, multi-channel interfacing, or advanced prototyping platforms that require predictable operating conditions, a compact FBGA package, and RoHS compliance. The documented electrical characteristics and family-level datasheet support system-level integration and reliability assessments.

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